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1.发明授权Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same 有权具有高密度和低密度衬底区域的混合衬底及其制造方法公开(公告)号：US09159693B2
公开(公告)日：2015-10-13
申请号：US14063699
申请日：2013-10-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Won Choi
CPC classification number: H01L24/80 , H01L23/49822 , H01L23/49833 , H01L24/16 , H01L2224/16225 , H01L2924/12042 , H05K1/183 , H05K1/185 , H05K3/0097 , H05K3/4688 , H05K2201/0187 , H05K2201/09727 , H05K2203/061 , H05K2203/063 , H05K2203/1536 , H01L2924/00
Abstract: Provided is a hybrid substrate with high density and low density substrate areas and a method of manufacturing the same. The hybrid substrate with high density and low density substrate areas includes a low density substrate layer having a cavity and a low density area, a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area having a higher pattern density than that of the low density area, an insulating support layer comprising a deposition area formed on upper portions, lower portions and the upper and lower portions of the high density substrate layer and the low density substrate layer, insulating layer vias passing through the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer, and an outer pattern layer.
Abstract translation: 提供了具有高密度和低密度基板区域的混合基板及其制造方法。 具有高密度和低密度衬底区域的混合衬底包括具有空腔和低密度面积的低密度衬底层，安装在低密度衬底层的空腔中的高密度衬底层，并由具有 具有比低密度区域更高的图案密度的绝缘支撑层，包括形成在高密度衬底层的上部，下部和上部和下部的沉积区域和低密度衬底层的绝缘支撑层，绝缘层通孔 绝缘支撑层的沉积区域和与高密度衬底层和低密度衬底层的图案相连，以及外部图案层。
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公开(公告)号：US08708215B2
公开(公告)日：2014-04-29
申请号：US13894312
申请日：2013-05-14
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hueng Jae Oh , Yon Ho You , Jin Won Choi
IPC: B23K37/00
CPC classification number: B23K3/0623
Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.
Abstract translation: 本发明公开了一种焊球供给装置，其特征在于，包括：盒形状，盒内嵌有多个焊球; 耦合到所述盒的下部的振动单元; 以及金属掩模，与所述振动单元的下部一体地结合，并且在其整个表面上形成有多个孔。
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3.发明授权公开(公告)号：US08651356B2
公开(公告)日：2014-02-18
申请号：US13675235
申请日：2012-11-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Noriaki Mukai , Hueng Jae Oh , Dae Young Lee , Jin Won Choi
CPC classification number: B23K3/0661 , B23K3/0653
Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
Abstract translation: 这里公开了一种在衬底上进行焊接工艺的焊料凸点形成装置，该焊料凸点形成装置包括：焊料槽，其中容纳焊料; 搅拌器搅动焊料槽中的焊料; 驱动搅拌器的司机 以及向衬底提供吸力的抽吸压力提供器。
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公开(公告)号：US09142499B2
公开(公告)日：2015-09-22
申请号：US14302045
申请日：2014-06-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Taek Lee , Hueng Jae Oh , Sung Won Jeong , Gi Sub Lee , Jin Won Choi
IPC: H01L23/12 , H01L23/498
CPC classification number: H01L23/49811 , H01L23/49805 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
Abstract translation: 用于封装衬底的引脚包括：连接销插入形成在外部衬底中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。
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公开(公告)号：US20130237049A1
公开(公告)日：2013-09-12
申请号：US13866464
申请日：2013-04-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Gyu Lee , Dae Young Lee , Tae Joon Chung , Seon Jae Mun , Jin Won Choi
IPC: H01L21/48
CPC classification number: H01L21/4853 , H01L21/441 , H01L23/485 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0346 , H01L2224/0347 , H01L2224/05572 , H01L2224/1147 , H01L2224/11849 , H01L2224/13082
Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.
Abstract translation: 一种制造封装衬底的方法，包括制备具有至少一个导电焊盘的衬底，形成具有开口的绝缘层，以暴露衬底上的导电焊盘，在开口内的导电焊盘上形成分离阻挡层，高于 绝缘层的沿其侧壁的上表面，在分离阻挡层上形成柱端子，并在焊接端子上形成焊料凸点。
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Patent Agency Ranking
公开(公告)号：US20130168144A1
公开(公告)日：2013-07-04
申请号：US13717504
申请日：2012-12-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Won Jeong , Seon Jae Mun , Boo Yang Jung , Dae Young Lee , Jin Won Choi
CPC classification number: H05K3/4007 , H01L2924/0002 , H05K1/0296 , H05K3/4015 , H05K2201/099 , H05K2201/10242 , H01L2924/00
Abstract: The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a predetermined height; disposing the conductive material on the electrode pad; and forming a conductive post on the electrode pad by bonding the electrode pad and the conductive material, and can achieve a fine pitch and easily implement a conductive post with a high aspect ratio.
Abstract translation: 印刷电路板的制造方法技术领域本发明涉及一种印刷电路板的制造方法，其特征在于，包括：准备具有电极焊盘的基板; 提供具有预定高度的导电材料; 将导电材料设置在电极焊盘上; 并且通过接合电极焊盘和导电材料在电极焊盘上形成导电柱，并且可以实现微细间距并容易地实现具有高纵横比的导电柱。
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7.发明授权Packaging method using solder coating ball and package having solder pattern including metal pattern 有权使用焊锡涂层球的包装方法和包含金属图案的焊料图案的包装公开(公告)号：US08952531B2
公开(公告)日：2015-02-10
申请号：US13845108
申请日：2013-03-18
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jin Won Choi , Yon Ho You
IPC: H01L23/498 , H01L21/768 , H01L23/00
CPC classification number: H01L24/16 , H01L21/76895 , H01L23/49816 , H01L23/49894 , H01L24/81 , H01L2224/13082 , H01L2224/131 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81193 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2924/00014 , H01L2924/014
Abstract: A packaging method comprises steps of forming a plurality of pads and another circuit pattern on a substrate, forming a second dry film pattern including opening exposing the pad, mounting a solder coating ball in the opening of the second dry film pattern, performing a reflow process on the solder coating ball in order to allow the solder coating ball to have a modified pattern, delaminating the second dry film pattern, and forming a solder pattern including the modified pattern of the solder coating ball in a solder to mount a chip on the substrate using the solder pattern.
Abstract translation: 包装方法包括以下步骤：在基板上形成多个焊盘和另一个电路图案，形成第二干膜图案，其包括露出焊盘的开口，将焊料涂覆球安装在第二干膜图案的开口中，执行回流工艺 在焊锡涂层球上，以使焊料涂层球具有改性图案，使第二干膜图案分层，并且形成包括焊料涂覆球的改进图案的焊料图案以将芯片安装在基板上 使用焊料图案。
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公开(公告)号：US08835302B2
公开(公告)日：2014-09-16
申请号：US13866464
申请日：2013-04-19
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Dong Gyu Lee , Dae Young Lee , Tae Joon Chung , Seon Jae Mun , Jin Won Choi
IPC: H01L23/495 , H01L21/48 , H01L21/441 , H01L23/485
CPC classification number: H01L21/4853 , H01L21/441 , H01L23/485 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0346 , H01L2224/0347 , H01L2224/05572 , H01L2224/1147 , H01L2224/11849 , H01L2224/13082
Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.
Abstract translation: 一种制造封装衬底的方法，包括制备具有至少一个导电焊盘的衬底，形成具有开口的绝缘层，以暴露衬底上的导电焊盘，在开口内的导电焊盘上形成分离阻挡层，高于 绝缘层的沿其侧壁的上表面，在分离阻挡层上形成柱端子，并在焊接端子上形成焊料凸点。
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公开(公告)号：US08740040B2
公开(公告)日：2014-06-03
申请号：US13664035
申请日：2012-10-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jin Won Choi , Yon Ho You , Ki Ju Lee
IPC: B23K1/00
CPC classification number: B23K3/0623
Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
Abstract translation: 本文公开了一种焊料注入头，包括：凸块材料存储部分，其中存储有凸块材料; 排出部分，其一侧连接到凸块材料存储部分，并将凸块材料排出到外部; 加热部，其形成在所述排出部的至少一侧，并加热通过所述排出部的所述凸块材料; 以及压配部件，将排出到外部的凸块材料压入，并将凸块材料注入到基板上。
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10.发明申请MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMPING METHOD USING THE SAME 审中-公开电路板上的焊接棒和使用其的焊接球保护方法的掩模公开(公告)号：US20140103098A1
公开(公告)日：2014-04-17
申请号：US14048839
申请日：2013-10-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Won Choi , Yon Ho YOU , Seon Jae MUN , Noriaki MUKAI , Seung Wan KIM , KiJu LEE , Jung In CHOI
CPC classification number: B23K3/06 , B23K3/0623 , B23K3/082 , H01L24/11
Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.
Abstract translation: 本文公开了一种用于在电路板上焊接焊球的掩模和使用该掩模的焊球凸块方法。 掩模包括：多个开口，提供空间，焊球插入其中，从而被安置在焊盘上; 以及沟槽，其提供引导空间，用于将焊剂铺展到焊球位于焊盘上并从开口周边的至少一侧延伸的部分。
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