公开(公告)号：US20230230752A1

公开(公告)日：2023-07-20

申请号：US17824560

申请日：2022-05-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ji Kim ,  Kwang Sun Choi ,  Jin Ho Ku

IPC: H01F27/29 ,  H01F27/32 ,  H01F41/10 ,  H01F41/12

CPC classification number: H01F27/292 ,  H01F27/323 ,  H01F41/10 ,  H01F41/122

Abstract: According to an aspect of the present disclosure, a coil component includes: a body having a first surface and a second surface opposing each other in a first direction, and a plurality of side surfaces connecting the first surface and the second surface to each other; a substrate disposed in the body; at least one insulating pattern disposed on at least one corner where two of the plurality of side surfaces of the body are in contact with each other and exposed to the two side surfaces of the body; a coil unit including a coil pattern disposed on at least one surface of the substrate with a plurality of turns, and lead-out portions respectively exposed to opposing ones of the plurality of side surfaces of the body; and external electrodes disposed on the body and connected to the lead-out portions, respectively.

公开(公告)号：US20190198221A1

公开(公告)日：2019-06-27

申请号：US16011886

申请日：2018-06-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Sun Choi

IPC: H01F27/255 ,  H01F27/28 ,  H01F27/32 ,  H01F17/00 ,  H01F17/04

CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/2804 ,  H01F27/324

Abstract: A chip electronic component includes a magnetic body including first magnetic metal particles, internal coil portions embedded within the magnetic body, and insulation resistance layers disposed on upper and lower surfaces of the magnetic body and including second magnetic metal particles having an oxide coating.

公开(公告)号：US11342107B2

公开(公告)日：2022-05-24

申请号：US16011886

申请日：2018-06-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Sun Choi

IPC: H01F27/32 ,  H01F27/36 ,  H01F27/255 ,  H01F27/28 ,  H01F17/04 ,  H01F17/00 ,  H01F3/10

Abstract: A chip electronic component includes a magnetic body including first magnetic metal particles, internal coil portions embedded within the magnetic body, and insulation resistance layers disposed on upper and lower surfaces of the magnetic body and including second magnetic metal particles having an oxide coating.

公开(公告)号：US11342110B2

公开(公告)日：2022-05-24

申请号：US16031216

申请日：2018-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Woo Oh ,  Hyung Jin Jeon ,  Jung Wook Seo ,  Young Seuck Yoo ,  Byoung Hwa Lee ,  Kwang Sun Choi ,  Kun Ho Koo

IPC: H01F27/29 ,  H01F27/06 ,  H01F27/32 ,  H01F17/00 ,  H01F17/04 ,  H01F1/37

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.