公开(公告)号：US20130199035A1

公开(公告)日：2013-08-08

申请号：US13753727

申请日：2013-01-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Yune Kim ,  Tae Eun Chang ,  Suk Hyeong Cho

IPC: H05K3/42

CPC classification number: H05K3/428 ,  H05K3/007 ,  Y10T29/49165 ,  Y10T29/53265

Abstract: Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board.

Abstract translation: 本发明公开了一种用于制造印刷电路板的载体，该载体包括：由基底基板构成的芯部件，堆叠在基底基板的两个表面上的第一金属层和堆叠在第一金属层上的第二金属层; 以及完全包裹芯部件的外围部分的保护单元，从而可以通过承载件的外围部分被保护单元包裹的结构来最小化物理和化学应力，从而提高印刷电路板的制造成品率 。