公开(公告)号：US20140060899A1

公开(公告)日：2014-03-06

申请号：US13681698

申请日：2012-11-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Hwan Park ,  Keung Jin Sohn ,  Tae Eun Chang

IPC: H05K1/03 ,  B32B15/08 ,  B32B15/09 ,  B32B15/098 ,  B32B7/02 ,  B32B15/088

CPC classification number: H05K1/032 ,  B32B7/02 ,  B32B15/08 ,  B32B15/088 ,  B32B15/09 ,  B32B15/098 ,  B32B15/20 ,  B32B2262/00 ,  H05K1/0366 ,  H05K3/4673 ,  H05K2201/0141 ,  H05K2201/029 ,  Y10T428/24942

Abstract: Disclosed herein are prepreg, a copper clad laminate (CCL), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of thermal expansion (CTE) and rigidity may be adjusted. In addition, during an operation of a semiconductor chip mounted on the printed circuit board, the semiconductor chip and the printed circuit board expand and contract due to heat by as much as similar degrees, and thus, the reliability of a solder joint may be enhanced. Moreover, fiber protrusion failure may be prevented compared with a case a via hole is processed by using a CO2 laser drill, thereby minimizing substrate failures.

Abstract translation: 本文公开了预浸料，覆铜层压板（CCL）和印刷电路板。 当使用包含液晶聚合物树脂或超级工程树脂的有机纤维形成的加强件和具有与加强件相同成分的基础树脂时，可以调节热膨胀系数（CTE）和刚度。 此外，在安装在印刷电路板上的半导体芯片的操作期间，半导体芯片和印刷电路板由于热量而扩张和收缩程度相同，因此可以提高焊点的可靠性 。 此外，与通过使用CO 2激光钻头处理通孔的情况相比，可以防止纤维突出失效，从而最小化基板故障。

公开(公告)号：US20130199035A1

公开(公告)日：2013-08-08

申请号：US13753727

申请日：2013-01-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Yune Kim ,  Tae Eun Chang ,  Suk Hyeong Cho

IPC: H05K3/42

CPC classification number: H05K3/428 ,  H05K3/007 ,  Y10T29/49165 ,  Y10T29/53265

Abstract: Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board.

Abstract translation: 本发明公开了一种用于制造印刷电路板的载体，该载体包括：由基底基板构成的芯部件，堆叠在基底基板的两个表面上的第一金属层和堆叠在第一金属层上的第二金属层; 以及完全包裹芯部件的外围部分的保护单元，从而可以通过承载件的外围部分被保护单元包裹的结构来最小化物理和化学应力，从而提高印刷电路板的制造成品率 。