公开(公告)号：US20150351238A1

公开(公告)日：2015-12-03

申请号：US14565162

申请日：2014-12-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Gon KIM ,  Katsushi YASUDA ,  Soon Bum LEE

IPC: H05K1/11 ,  H01L41/047 ,  H01L41/053 ,  H05K5/00

CPC classification number: H03H9/1085 ,  H01L2224/14 ,  H03H9/1007 ,  H05K3/3436 ,  H05K2201/10083

Abstract: There are provided a device and a device package including a terminal electrically connected to a board and including one or more protrusion parts disposed on amounting surface on which the terminal is mounted on the board and the protrusion part is protruded from the mounting surface of the terminal.

Abstract translation: 提供了一种装置和装置封装，其包括电连接到基板的端子，并且包括设置在端子安装在基板上的突出表面上的一个或多个突出部分，并且突出部分从端子的安装表面突出 。

公开(公告)号：US20140355646A1

公开(公告)日：2014-12-04

申请号：US14294749

申请日：2014-06-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Pil LEE ,  Sang Yeob CHA ,  Soon Bum LEE ,  Jong Beom JEON ,  Katsushi YASUDA

IPC: G01K7/32 ,  H01L41/25

CPC classification number: H01L41/25 ,  G01K1/14 ,  H03H9/0547 ,  H03H9/08 ,  H03H9/1014 ,  Y10T29/42

Abstract: A piezoelectric device package may include: a case having a plurality of terminals disposed on a lower surface thereof; a piezoelectric device disposed in the case; a temperature measuring device disposed on one surface of the piezoelectric device in the case and having a thin film form; and a cover member enclosing an upper portion of the case.

Abstract translation: 压电器件封装可以包括：具有设置在其下表面上的多个端子的壳体; 设置在壳体中的压电装置; 温度测量装置，其设置在壳体的压电装置的一个表面上并且具有薄膜形式; 以及封闭壳体的上部的盖构件。