公开(公告)号：US20150177028A1

公开(公告)日：2015-06-25

申请号：US14295963

申请日：2014-06-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sun Kyu LEE ,  Tae Kon KOO ,  Tae Hoon KIM ,  Kyu Hwan OH ,  Seog Moon CHOI

IPC: G01D11/24 ,  H01L35/00 ,  H01L23/495

CPC classification number: G01D11/245 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/495 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically connected to the terminal part through a bonding wire; and a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion.

Abstract translation: 传感器封装可以允许流体平滑流动，从而增加响应特性。 传感器封装可以包括：端子部分; 至少一个电子元件通过接合线电连接到端子部分; 以及模制部件，其封装所述接合线和所述电子元件，并且包括部分地暴露所述电子元件的感测部分和将周围流体引导到所述感测部分的至少一个引导部。