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公开(公告)号：US20140174940A1
公开(公告)日：2014-06-26
申请号：US14179207
申请日：2014-02-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chang Hyun LIM , Seog Moon CHOI , Sang Hyun SHIN , Young Ki LEE , Sung Keun PARK
IPC: H05K3/02
CPC classification number: H05K3/02 , H05K1/0201 , H05K1/053 , H05K3/0061 , H05K2201/062 , H05K2201/09881 , H05K2201/09972 , H05K2203/0315
Abstract: Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
Abstract translation: 本发明的实施例提供散热基板和散热基板的制造方法。 根据各种实施例，散热基板包括由形成在分割区域中的第一绝缘体分隔的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。
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2.发明申请公开(公告)号：US20140113393A1
公开(公告)日：2014-04-24
申请号：US14146111
申请日：2014-01-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hyun PARK , Seog Moon CHOI , Tae Hoon KIM , Sang Hyun SHIN , Tae Hyun KIM
IPC: H01L33/58
CPC classification number: H01L33/56 , H01L24/45 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.
Abstract translation: 本文公开了一种制造用于光学元件的封装衬底的方法。 该方法包括以下步骤：提供导电衬底，在导电衬底中形成空腔，并在导电衬底上形成绝缘层。 该方法还包括以下步骤：使用电镀工艺在导电衬底上形成电路层和电极焊盘，在电路层中形成包括下部和侧壁的空腔，以及将光学元件安装在空腔中， 然后在其上施加荧光树脂层。
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3.发明申请公开(公告)号：US20130045550A1
公开(公告)日：2013-02-21
申请号：US13654313
申请日：2012-10-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hyun PARK , Seog Moon CHOI , Tae Hoon KIM , Sang Hyun SHIN , Tae Hyun KIM
IPC: H01L33/58
CPC classification number: H01L33/56 , H01L24/45 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate 11 and has a cavity space therein; electrode pads which are formed on the conductive substrate and which are spaced apart from the circuit layer by predetermined intervals such that trenches are formed between the circuit layer and the electrode pads; an optical element which is mounted in the cavity space of the circuit layer and which is electrically connected with the electrode pads; and a fluorescent resin layer which is formed on the circuit layer and the optical element to allow the optical element to uniformly emit light. The package substrate is advantageous in that uniform white light can be realized.
Abstract translation: 本文公开了一种用于光学元件的封装基板，包括：导电基板，其上形成有绝缘层; 电路层，其形成在导电基板11上并具有空腔; 电极焊盘，其形成在导电衬底上并且与电路层隔开预定间隔，使得在电路层和电极焊盘之间形成沟槽; 光学元件，其安装在所述电路层的空腔中并与所述电极焊盘电连接; 以及形成在电路层和光学元件上以允许光学元件均匀发光的荧光树脂层。 封装基板的优点在于可以实现均匀的白光。
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公开(公告)号：US20220066022A1
公开(公告)日：2022-03-03
申请号：US17232300
申请日：2021-04-16
Applicant: Samsung Electro-Mechanics Co., Ltd
Inventor： Young Ki LEE , Joon Seok CHAE , Seog Moon CHOI , Tae Gyu RYU
IPC: G01S13/86 , G02B7/09 , G03B13/36 , G02B27/64 , G03B5/00 , G02B13/00 , B60R11/04 , G01S13/931 , H04N5/232 , H04N5/225
Abstract: A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.
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Patent Agency Ranking
公开(公告)号：US20210126353A1
公开(公告)日：2021-04-29
申请号：US16789968
申请日：2020-02-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hong Seok LEE , Bo Hyun SEO , Sung Youl CHOI , Young Ki LEE , Tae Gyu RYU , Seog Moon CHOI
Abstract: An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.
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公开(公告)号：US20150177028A1
公开(公告)日：2015-06-25
申请号：US14295963
申请日：2014-06-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sun Kyu LEE , Tae Kon KOO , Tae Hoon KIM , Kyu Hwan OH , Seog Moon CHOI
IPC: G01D11/24 , H01L35/00 , H01L23/495
CPC classification number: G01D11/245 , H01L23/3107 , H01L23/34 , H01L23/495 , H01L23/49541 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
Abstract: A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically connected to the terminal part through a bonding wire; and a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion.
Abstract translation: 传感器封装可以允许流体平滑流动，从而增加响应特性。 传感器封装可以包括：端子部分; 至少一个电子元件通过接合线电连接到端子部分; 以及模制部件，其封装所述接合线和所述电子元件，并且包括部分地暴露所述电子元件的感测部分和将周围流体引导到所述感测部分的至少一个引导部。
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公开(公告)号：US20140317919A1
公开(公告)日：2014-10-30
申请号：US14323728
申请日：2014-07-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Su KIM , Seog Moon CHOI
IPC: H05K3/34
CPC classification number: H05K3/3457 , H01L21/4853 , H01L24/11 , H01L2224/11003 , H01L2224/13099 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/3511 , H05K3/0052 , H05K3/3478 , H05K2203/0405 , Y10T29/49128 , Y10T29/49135 , Y10T29/4914 , Y10T29/49149 , Y10T29/49155 , Y10T29/49169 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board. The method includes the steps of mounting a strip substrate on a fixing member, and separating the strip substrate into unit substrates by performing a singulation process. The method further includes the steps of attaching solder balls onto the unit substrates using a mask disposed on the unit substrates, and fixing the solder balls on the unit substrates by performing a reflow process.
Abstract translation: 本发明的实施例提供一种制造印刷电路板的方法。 该方法包括以下步骤：将带状基材安装在固定部件上，并通过执行切割处理将带状基板分离成单元基板。 该方法还包括使用设置在单元基板上的掩模将焊球附着到单元基板上的步骤，以及通过进行回流处理将焊球固定在单元基板上。
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8.发明申请公开(公告)号：US20140113392A1
公开(公告)日：2014-04-24
申请号：US14145514
申请日：2013-12-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hyun PARK , Seog Moon CHOI , Tae Hoon KIM , Sang Hyun SHIN , Tae Hyun KIM
CPC classification number: H01L33/56 , H01L24/45 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.
Abstract translation: 本文公开了一种制造用于光学元件的封装衬底的方法。 该方法包括以下步骤：提供包括形成在其上的绝缘层的导电基板，以及使用电镀工艺在导电基板上形成电路层和电极焊盘。 该方法还包括选择性地将其中要安装光学元件的电路层与导体相隔一定厚度以使光学元件被掩埋，从而在电路层中形成包括下部和侧壁的腔空间 ，并将光学元件安装在空腔中，然后在其上施加荧光树脂层。
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公开(公告)号：US20140096380A1
公开(公告)日：2014-04-10
申请号：US14133157
申请日：2013-12-18
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Chang Hyun LIM , Jung Eun KANG , Heung Soo PARK , Seog Moon CHOI , Kwang Soo KIM , Joon Seok CHAE , Sung Keun PARK
CPC classification number: H05K3/10 , H05K1/0203 , H05K1/053 , H05K3/108 , H05K3/44 , H05K3/445 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , H05K2203/0315 , Y10T29/4913
Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
Abstract translation: 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。
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