MULTILAYER ELECTRONIC COMPONENT AND DIELECTRIC COMPOSITION

    公开(公告)号:US20220181082A1

    公开(公告)日:2022-06-09

    申请号:US17501215

    申请日:2021-10-14

    Inventor: Tae Young HAM

    Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, wherein, wherein a central portion of the capacitance formation portion is Aa, a boundary portion of the capacitance formation portion, adjacent to the cover portions, is Ab, a dielectric grain size corresponding to the top 50% of dielectric grains, in order of enlargement, from the smallest grain size, among a plurality of dielectric grains included in Aa, is D50a, and a dielectric grain size corresponding to the top 50% of dielectric grains, in order of enlargement, from the smallest grain size, among a plurality of dielectric grains included in Ab, is D50b, D50a satisfies 190 nm or less and D50b satisfies 120 nm or greater.

    MULTILAYER CAPACITOR
    6.
    发明申请

    公开(公告)号:US20190148042A1

    公开(公告)日:2019-05-16

    申请号:US15989507

    申请日:2018-05-25

    Abstract: A multilayer capacitor includes: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively. The dielectric layer contains BaTiO3 as a main ingredient, and includes a plurality of grains and grain boundaries formed between adjacent grains, the grain boundary containing Si in an amount of 8.0 to 18.0 wt % and Al and Mg in a total content of 2.0 to 6.0 wt %.

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