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公开(公告)号:US20230082113A1
公开(公告)日:2023-03-16
申请号:US17992469
申请日:2022-11-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Young HAM , Ji Hong JO , Seung In BAIK , Hyung Soon KWON
IPC: H01G4/12 , H01G4/30 , H01G4/012 , H01G4/248 , C04B35/468
Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.
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公开(公告)号:US20200251242A1
公开(公告)日:2020-08-06
申请号:US16458751
申请日:2019-07-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hyung Soon KWON , Jae Sung PARK , Min Young CHOI , Ki Myoung YUN , Hyoung Uk KIM , Tae Young HAM , Seung In BAIK
IPC: H01B3/12 , H01G4/12 , H01G4/012 , C04B35/468
Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor comprising the same includes a barium titanate (BaTiO3)-based base material main ingredient and an accessory ingredient, and the accessory ingredient includes a third trivalent lanthanide rare earth element A and terbium (Tb) as rare earth elements, and a molar ratio (Tb/A) of a content of terbium (Tb) to the content of the trivalent lanthanide rare earth element A satisfies 0.15≤Tb/A
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公开(公告)号:US20190244757A1
公开(公告)日:2019-08-08
申请号:US16123929
申请日:2018-09-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hyung Soon KWON , Hyoung Uk KIM , Tae Young HAM , Jong Han KIM , Ki Myoung YUN , Jae Sung PARK
IPC: H01G4/12 , H01G4/008 , H01G4/30 , C01G23/00 , C04B35/468 , C04B35/626 , B32B18/00
Abstract: A capacitor component includes a body in which a dielectric layer and an internal electrode are alternately stacked, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a composite layer including a dielectric material powder and a metallic particle and first and second protective layers including a dielectric material powder and spaced apart by the composite layer. A thickness of each of the first and second protective layers is equal to or greater than ⅓ of a thickness of the dielectric layer.
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公开(公告)号:US20240258032A1
公开(公告)日:2024-08-01
申请号:US18631625
申请日:2024-04-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Young HAM , Ji Hong JO , Seung In BAIK , Hyung Soon KWON
IPC: H01G4/12 , C04B35/468 , H01G4/012 , H01G4/248 , H01G4/30
CPC classification number: H01G4/1227 , C04B35/4682 , H01G4/012 , H01G4/248 , H01G4/30 , C04B2235/3206 , C04B2235/3224 , C04B2235/3236 , C04B2235/3251 , C04B2235/768 , C04B2235/785
Abstract: A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.
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公开(公告)号:US20220181082A1
公开(公告)日:2022-06-09
申请号:US17501215
申请日:2021-10-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Young HAM
IPC: H01G4/12 , H01G4/30 , C04B35/468
Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, wherein, wherein a central portion of the capacitance formation portion is Aa, a boundary portion of the capacitance formation portion, adjacent to the cover portions, is Ab, a dielectric grain size corresponding to the top 50% of dielectric grains, in order of enlargement, from the smallest grain size, among a plurality of dielectric grains included in Aa, is D50a, and a dielectric grain size corresponding to the top 50% of dielectric grains, in order of enlargement, from the smallest grain size, among a plurality of dielectric grains included in Ab, is D50b, D50a satisfies 190 nm or less and D50b satisfies 120 nm or greater.
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公开(公告)号:US20190148042A1
公开(公告)日:2019-05-16
申请号:US15989507
申请日:2018-05-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ki Myoung YUN , Hyoung Uk KIM , Jae Sung PARK , Tae Young HAM , Hyung Soon KWON , Jong Han KIM
Abstract: A multilayer capacitor includes: a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively. The dielectric layer contains BaTiO3 as a main ingredient, and includes a plurality of grains and grain boundaries formed between adjacent grains, the grain boundary containing Si in an amount of 8.0 to 18.0 wt % and Al and Mg in a total content of 2.0 to 6.0 wt %.
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公开(公告)号:US20200258685A1
公开(公告)日:2020-08-13
申请号:US16400706
申请日:2019-05-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Young HAM , Hyoung Uk KIM , Kyoung Jin CHA , Min Young CHOI , Ji Hong JO , Seung In BAIK
IPC: H01G4/12 , H01G4/30 , H01G4/005 , C04B35/468
Abstract: A dielectric ceramic composition includes a barium titanate-based base material main ingredient and an accessory ingredient, and the accessory ingredient includes dysprosium (Dy) and gadolinium (Gd) as first accessory ingredient elements, and a content ratio of gadolinium (Gd), based on a total content of the first accessory ingredient elements, is 25% or higher.
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公开(公告)号:US20200043658A1
公开(公告)日:2020-02-06
申请号:US16143231
申请日:2018-09-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Min Young CHOI , Hyoung Uk KIM , Ki Myoung YUN , Tae Young HAM , Hyung Soon KWON
Abstract: A dielectric composition includes: a base material powder including (Ca1-xSrx) (Zr1-yTiy)O3 (0
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公开(公告)号:US20190135701A1
公开(公告)日:2019-05-09
申请号:US15889856
申请日:2018-02-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ki Myoung YUN , Dong Jun JUNG , Jae Sung PARK , Tae Young HAM , Hyung Soon KWON , Jong Han KIM , Hyoung Uk KIM
IPC: C04B35/468 , H01G4/12 , H01G4/232 , H01G4/30
CPC classification number: C04B35/4682 , C04B35/49 , C04B2235/3206 , C04B2235/3208 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3236 , C04B2235/3239 , C04B2235/3241 , C04B2235/3244 , C04B2235/3262 , C04B2235/3263 , C04B2235/3272 , C04B2235/3275 , C04B2235/3281 , C04B2235/3284 , C04B2235/3293 , C04B2235/3418 , C04B2235/36 , C04B2235/442 , C04B2235/5454 , C04B2235/6582 , C04B2235/663 , C04B2235/768 , C04B2235/781 , C04B2235/785 , C04B2235/79 , C04B2235/85 , H01G4/012 , H01G4/1227 , H01G4/1236 , H01G4/232 , H01G4/30
Abstract: A multilayer electronic component includes: a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein each of the dielectric layers includes BamTiO3 and includes a plurality of grains and grain boundaries formed between adjacent grains, and a sum of contents of Si and Dy in the grain boundary is 10 to 15 parts by weight.
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