公开(公告)号：US20160276074A1

公开(公告)日：2016-09-22

申请号：US15072594

申请日：2016-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Jae LEE ,  Jung Wook SEO ,  Hiroyuki MATSUMOTO ,  Chul Min SIM ,  Jong Sik YOON ,  Jong Suk JUNG

IPC: H01F1/047 ,  B22F1/02 ,  C23D5/04 ,  H01F1/06

CPC classification number: C23D5/04 ,  B22F1/02 ,  C22C33/02 ,  H01F1/24 ,  H01F1/33

Abstract: A magnetic powder contains magnetic particles, a first coating layer disposed on surfaces of the magnetic particles and containing a first glass, and a second coating layer disposed on the first coating layer and containing a second glass different from the first glass. A method of manufacturing magnetic powder includes preparing magnetic particles, forming a first coating layer containing a first glass on surfaces of the magnetic particles, and forming a second coating layer containing a second glass different from the first glass on the first coating layer.

Abstract translation: 磁性粉末含有磁性粒子，设置在磁性粒子的表面上并且含有第一玻璃的第一被覆层和设置在第一被覆层上并且含有与第一玻璃不同的第二玻璃的第二被覆层。 制造磁粉的方法包括制备磁性颗粒，在磁性颗粒的表面上形成含有第一玻璃的第一涂层，以及在第一涂层上形成含有与第一玻璃不同的第二玻璃的第二涂层。

公开(公告)号：US20150017056A1

公开(公告)日：2015-01-15

申请号：US14328351

申请日：2014-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hak Kwan KIM ,  Sang Kyun KWON ,  Sung Jae LEE ,  Sung Yong AN

IPC: H01F1/147 ,  H01F1/20 ,  B22F1/02 ,  C23C8/66 ,  C21D9/00

CPC classification number: B22F1/02 ,  C21D1/74 ,  C21D9/0068 ,  C21D2211/009 ,  C22C33/0242 ,  C22C2202/02 ,  C23C8/22 ,  C23C8/66 ,  C23C8/80 ,  H01F1/22 ,  H01F3/08 ,  H01F41/0246

Abstract: Disclosed herein are a soft magnetic metal powder having a pearlite lamellar structure in which ferrite structures and cementite structures are repeated, a method for preparing the same, and an electronic component including the same as a core material.According to the present invention, the soft magnetic metal powder having the pearlite lamellar structure in which the ferrite structures and the cementite structures are repeated may be easily prepared, and an eddy current loss may be easily decreased without changing the existing molding process, such that the soft magnetic metal powder may be used as a core material of various electronic components such as an inductor, a motor, an actuator, a sensor, a transformer, and a reactor, requiring soft magnetic properties.

Abstract translation: 本文公开了具有重复铁素体结构和渗碳体结构的珠光体层状结构的软磁性金属粉末，其制备方法以及包含该芯材的电子部件。 根据本发明，可以容易地制备其中重复铁素体结构和渗碳体结构的具有珠光体层状结构的软磁性金属粉末，并且可以容易地减少涡流损耗，而不改变现有的模制过程，使得 可以将软磁性金属粉末用作要求软磁性能的电感器，电动机，致动器，传感器，变压器和电抗器等各种电子部件的芯材。

公开(公告)号：US20230224586A1

公开(公告)日：2023-07-13

申请号：US17988843

申请日：2022-11-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyung Hun LEE ,  Gab Yong KIM ,  Sung Jae LEE

IPC: H04N5/232 ,  H02K11/215 ,  H02K41/035 ,  H04N5/225

CPC classification number: H04N5/23287 ,  H02K11/215 ,  H02K41/0354 ,  H04N5/2253 ,  G03B13/36

Abstract: An optical image stabilization actuator is provided. The optical image stabilization actuator includes a sensor substrate on which an image sensor having an imaging plane is disposed; a fixed frame configured to accommodate the sensor substrate; a movable frame accommodated in the fixed frame and configured to move in a direction parallel to the imaging plane; a first ball member disposed between the fixed frame and the movable frame and configured to support movement of the movable frame; and a first driver disposed on the movable frame and the fixed frame and configured to provide driving force to the movable frame, wherein the sensor substrate includes a movable portion coupled to the movable frame, a fixed portion coupled to the fixed frame, and a plurality of bridges configured to movably support the movable portion.

公开(公告)号：US20230217093A1

公开(公告)日：2023-07-06

申请号：US17970852

申请日：2022-10-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Seo GU ,  Sung Jae LEE ,  Young Rok PARK

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H04N5/2252 ,  H04N5/2254 ,  H04N5/2253

Abstract: An image sensor module is provided. The image sensor module includes an image sensor which has a rectangular shape having a long side and a short side; a substrate which has a long side corresponding to the long side of the image sensor and a short side corresponding to the short side of the image sensor, wherein the image sensor is mounted on the substrate; a sub-housing installed on the substrate, the sub-housing having a first sidewall disposed on a side corresponding to the long side of the image sensor and a second sidewall disposed on a side corresponding to the short side of the image sensor; and an adhesive which bonds the sub-housing and the substrate, wherein a side surface of the substrate, disposed on the long side of the substrate and an outer surface of the adhesive are disposed on a same plane.

公开(公告)号：US20150038079A1

公开(公告)日：2015-02-05

申请号：US14446026

申请日：2014-07-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Kyun KWON ,  Sung Jae LEE ,  Hak Kwan KIM ,  Sung Yong AN

IPC: H04B5/00 ,  H01Q1/24 ,  H01Q21/00 ,  H01Q7/00

CPC classification number: H04B5/0081 ,  H01Q1/1257 ,  H01Q1/243 ,  H01Q3/24 ,  H04B5/0087

Abstract: The present invention relates to a device for wireless communication and a method for wireless communication. The device for wireless communication, which consists of a front surface having a display unit for displaying a screen thereon, a back surface opposite to the front surface, and a plurality of side surfaces except the front surface and the back surface, includes: a plurality of antennas provided on one surface selected from the plurality of side surfaces; and a near field communication (NFC) module connected to at least one of the plurality of antennas to transceive data and improves the degree of freedom in designing the device for wireless communication while increasing a read range and a read rate of near field communication.

Abstract translation: 本发明涉及无线通信装置及无线通信方法。 该无线通信装置包括具有用于显示屏幕的显示单元的前表面，与前表面相对的后表面以及除前表面和后表面之外的多个侧表面的多个设备，包括：多个 设置在从所述多个侧表面中选择的一个表面上的天线; 以及连接到所述多个天线中的至少一个天线以接收数据的近场通信（NFC）模块，并且在增加近场通信的读取范围和读取速率的同时提高了设计用于无线通信的设备的自由度。

公开(公告)号：US20190024245A1

公开(公告)日：2019-01-24

申请号：US16139696

申请日：2018-09-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Jae LEE ,  Jung Wook SEO ,  Hiroyuki MATSUMOTO ,  Chul Min SIM ,  Jong Sik YOON ,  Jong Suk JUNG

IPC: C23D5/04 ,  H01F1/33 ,  H01F1/24 ,  B22F1/02

Abstract: A magnetic powder contains magnetic particles, a first coating layer disposed on surfaces of the magnetic particles and containing a first glass, and a second coating layer disposed on the first coating layer and containing a second glass different from the first glass. A method of manufacturing magnetic powder includes preparing magnetic particles, forming a first coating layer containing a first glass on surfaces of the magnetic particles, and forming a second coating layer containing a second glass different from the first glass on the first coating layer.

公开(公告)号：US20150015359A1

公开(公告)日：2015-01-15

申请号：US14330817

申请日：2014-07-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hak Kwan KIM ,  Sang Kyun KWON ,  Sung Jae LEE ,  Sung Yong AN

IPC: H01F27/255 ,  B22F1/00 ,  B22F3/14

CPC classification number: H01F27/255 ,  B22F1/007 ,  B22F3/14 ,  B22F2003/145 ,  C22C33/0228 ,  H01F1/24 ,  H01F3/08 ,  H01F41/0246

Abstract: Disclosed herein are a soft magnetic composite including an insulating layer formed along an inter-particle boundary of a soft magnetic core metal powder, a method for preparing the same, and electronic components including the same as a core material.The soft magnetic composite according to the present invention may include the insulating layer formed along the inter-particle boundary of the soft magnetic core metal particles, such that damage to a coating film caused by a molding of the existing soft magnetic powder having the insulation coating film formed therein may be prevented, whereby an eddy current loss may be minimized.

Abstract translation: 本文公开了一种软磁性复合材料，其包括沿着软磁芯金属粉末的颗粒间边界形成的绝缘层，其制备方法以及包含该芯材的电子部件。 根据本发明的软磁性复合体可以包括沿软磁芯金属颗粒的颗粒间边界形成的绝缘层，使得由具有绝缘涂层的现有软磁性粉末的模制而导致的涂膜损伤 可以防止在其中形成的膜，从而可以使涡流损耗最小化。

公开(公告)号：US20130333207A1

公开(公告)日：2013-12-19

申请号：US13827488

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Jae LEE ,  Byung Jae Kim ,  Sang Jin Kim ,  Soo Gil Shin ,  Seung Hee Cho

IPC: H05K3/30

CPC classification number: H05K3/30 ,  H04N5/2253 ,  H04N5/2254 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0165 ,  Y02P70/613 ,  Y10T29/53174

Abstract: Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.

Abstract translation: 本文公开了一种用于制造相机模块的装置，该装置包括：从下方夹持PCB的基座夹具; 接合头拾取图像传感器并将图像传感器附接到PCB上; 以及壳体接合工具，其拾取壳体组件并将壳体组件附接到PCB上，使得附接到PCB上的图像传感器被容纳在壳体组件中，其中，基部夹具以基部夹具为张力的结构构成， 可沿垂直方向（Z轴方向）移动，使得当图像传感器被接合头拾取并附接到PCB上时，PCB的上表面是用于附接图像传感器和壳体组件的相同参考平面 。

公开(公告)号：US20140210027A1

公开(公告)日：2014-07-31

申请号：US14154758

申请日：2014-01-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Bum CHA ,  Sung Jae LEE ,  In Cheol CHANG ,  Sung Jun BYUN

IPC: H01L31/024

CPC classification number: H01L27/14685 ,  H01L24/83 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/3511 ,  H04N5/2257

Abstract: There is provided an image sensor module, including: an image sensor having a small thickness of 175 μm or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.

Abstract translation: 提供了一种图像传感器模块，包括：具有175μm或更小的小厚度并且具有第一热膨胀系数的图像传感器; 具有安装在其上并具有高于第一热膨胀系数的第二热膨胀系数的图像传感器的基板; 以及设置在图像传感器和基板之间并且在玻璃化转变温度Tg以上具有第三热膨胀系数为130ppm /℃以上的粘合剂的粘合剂层。