公开(公告)号：US20160308508A1

公开(公告)日：2016-10-20

申请号：US14988473

申请日：2016-01-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Sup CHO ,  Katsushi YASUDA ,  Sang Yeob CHA

IPC: H03H9/17 ,  H03H9/08 ,  H03H9/02 ,  H01L41/047 ,  H01L41/053

CPC classification number: H03H9/17 ,  H01L41/0475 ,  H01L41/053 ,  H03H9/02102 ,  H03H9/0519 ,  H03H9/0547 ,  H03H9/08

Abstract: A crystal device includes a package including a cavity formed therein, a thermistor disposed on a bottom surface of the cavity and integrated with the package, a crystal blank spaced apart from the thermistor in the cavity, and a lead coupled to the package so as to cover the cavity.

Abstract translation: 晶体装置包括：包括形成在其中的空腔的封装，设置在空腔的底表面上并与封装成一体的热敏电阻，与空腔中的热敏电阻间隔开的晶体空白，以及耦合到封装的引线，以便 覆盖空腔。