公开(公告)号：US20230395568A1

公开(公告)日：2023-12-07

申请号：US18116011

申请日：2023-03-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Buwon KIM ,  Sangsub SONG

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L23/3128 ,  H01L2225/06562 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48145 ,  H01L2224/48465

Abstract: In some embodiments, a semiconductor package includes a package substrate that includes a first surface, a second surface that is opposite to the first surface, first substrate pads disposed on the first surface in a first row, and second substrate pads disposed on the first surface in a second row. The semiconductor package further includes a first semiconductor chip that includes first chip pads, lower bonding wires configured to respectively couple the first chip pads and the first substrate pads, a second semiconductor chip that includes second chip pads, upper bonding wires configured to respectively couple the second chip pads and the second substrate pads, and an encapsulant disposed on the package substrate and covering the first semiconductor chip and the second semiconductor chip. The lower bonding wires are ball-bonded to the first chip pads and stich-bonded to the first substrate pads.