公开(公告)号：US20240321722A1

公开(公告)日：2024-09-26

申请号：US18481872

申请日：2023-10-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOONYOUNG JEON ,  YOUNGMIN KIM ,  JOON SEOK OH ,  CHANGBO LEE

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49894 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package includes a semiconductor chip, and a redistribution structure connected to the semiconductor chip. The redistribution structure may include an under bump pattern, a first redistribution layer disposed on the under bump pattern and including a first redistribution pad, a partition disposed inside the first redistribution pad and including a material that is different from that of the first redistribution pad, a contact via disposed on the first redistribution pad and the partition, and a second redistribution layer including a second redistribution pad disposed on the contact via.