公开(公告)号：US20200206870A1

公开(公告)日：2020-07-02

申请号：US16517849

申请日：2019-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun Seok LEE ,  Ja Eung KOO ,  Kuen Byul KIM ,  Jeong Min NA ,  Chang Gil RYU ,  Hyeon Dong SONG ,  Young Seok JANG ,  Jin Suk HONG

IPC: B24B53/017 ,  B24B57/02 ,  B24D13/14

Abstract: A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.