公开(公告)号：US20230073808A1

公开(公告)日：2023-03-09

申请号：US17986009

申请日：2022-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chigoo KANG ,  Seogho LIM ,  Ilseop WON ,  Jungwoo LEE

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L33/38 ,  H01L33/10 ,  G02F1/13357 ,  H01L27/146 ,  F21V5/04 ,  G02B19/00

Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.

公开(公告)号：US20210296393A1

公开(公告)日：2021-09-23

申请号：US17060215

申请日：2020-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chigoo KANG ,  Seogho LIM ,  Ilseop WON ,  Jungwoo LEE

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/10 ,  H01L33/60 ,  H01L33/38 ,  H01L33/48

Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.