公开(公告)号：US20140203830A1

公开(公告)日：2014-07-24

申请号：US14159828

申请日：2014-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DONG JAE SHIN ,  Yoon Dong Park ,  Sang Hun Choi ,  Kyoung Ho Ha

IPC: G01R31/26

CPC classification number: G01R31/2601

Abstract: A wafer test system includes an input device configured to transmit a test signal, a wafer including an optical port, an input port configured to receive the test signal, and an output port configured to output a result signal based on the test signal, a measuring device configured to measure the result signal, and an alignment device configured to align an optical fiber port of an optical probe with an alignment port based on the result signal and then align the optical fiber port with the optical port. The alignment port is the input port or the output port. The optical probe is configured to be the input device when the input port is the alignment port and the optical probe is configured to be the measuring device when the output port is the alignment port.

Abstract translation: 晶片测试系统包括被配置为传输测试信号的输入设备，包括光学端口的晶片，被配置为接收测试信号的输入端口以及被配置为基于测试信号输出结果信号的输出端口，测量 被配置为测量结果信号的装置，以及基于结果信号将光学探针的光纤端口与对准端口对准的对准装置，然后使光纤端口与光学端口对准。 对齐端口是输入端口或输出端口。 当输出端口为对准端口时，光电探头被配置为输入设备，并且光学探头被配置为测量设备。