公开(公告)号：US20250157879A1

公开(公告)日：2025-05-15

申请号：US18746857

申请日：2024-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM ,  Sungchan KANG ,  Daehyuk SON ,  Hotaik LEE ,  Seogwoo HONG

IPC: H01L23/427

Abstract: A semiconductor apparatus includes a semiconductor chip including a semiconductor integrated circuit, a cooling channel at least partially in the semiconductor chip and including a fine pattern on at least a portion of a wall surface of the cooling channel, the fine pattern configured to generate a capillary pressure that induces a flow of a liquid coolant, and a temperature controller configured to control a supply temperature of the liquid coolant supplied to the cooling channel.

公开(公告)号：US20250157883A1

公开(公告)日：2025-05-15

申请号：US18647903

申请日：2024-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Dongkyun KIM ,  Daehyuk SON ,  Hotaik LEE ,  Seogwoo HONG

IPC: H01L23/473 ,  H01L25/065

Abstract: A semiconductor device includes a semiconductor chip having a semiconductor integrated circuit. A cooling channel is formed in the semiconductor chip. At least a portion of the cooling channel is formed in the semiconductor chip. First wick structures may be arranged on a bottom of the cooling channel that is parallel to an upper surface of the semiconductor chip in a transverse direction. The first wick structures may move a liquid coolant by capillary action in the transverse direction along the bottom of the cooling channel. Second wick structures may be arranged along an inner surface of the vapor chamber and may move the liquid coolant by capillary action in the transverse direction along the inner surface of the vapor chamber.

公开(公告)号：US20230194646A1

公开(公告)日：2023-06-22

申请号：US17834176

申请日：2022-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehyuk SON ,  Cheheung Kim ,  Jaehyung Jang ,  Hyeokki Hong

IPC: G01S3/803 ,  H04R3/00 ,  H04R1/40

CPC classification number: G01S3/8038 ,  H04R1/406 ,  H04R3/005 ,  H04R2201/401 ,  H04R2430/21

Abstract: Provided is a direction estimating apparatus using an acoustic sensor, the direction estimating apparatus including a non-directional acoustic sensor, a plurality of directional acoustic sensors provided adjacent to the non-directional acoustic sensor, and a processor configured to obtain a first output signal from the non-directional acoustic sensor and a plurality of second output signals from the plurality of directional acoustic sensors, and estimate a direction of a sound source within an error range from -5 degrees to +5 degrees by comparing magnitudes between the two output signals and phase information between the first output signal and one of the second output signals.

公开(公告)号：US20250105093A1

公开(公告)日：2025-03-27

申请号：US18616721

申请日：2024-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehyuk SON ,  Sungchan KANG ,  Dongkyun KIM ,  Hotaik LEE ,  Seogwoo HONG

IPC: H01L23/427

Abstract: A semiconductor device may include: a semiconductor chip may include a heat radiation part; a pressure chamber formed on the heat radiation part, wherein the pressure chamber is configured to contain coolant such that an internal pressure in the pressure chamber increases as the coolant absorbs heat from the heat radiation part, and the coolant is ejected in a first direction away from the heat radiation part as the internal pressure of the pressure chamber increases; and a cooling channel providing a flow path configured such that the coolant ejected from the pressure chamber flows through the flow path and back into the pressure chamber.

公开(公告)号：US20250016957A1

公开(公告)日：2025-01-09

申请号：US18797053

申请日：2024-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHUNG ANG University Industry Academic Cooperation Foundation

Inventor： Daehyuk SON ,  Sungchan Kang ,  Seongwoo Hong ,  Daeyoung Kong ,  Kiwan Kim ,  Hyoungsoon Lee

IPC: H05K7/20 ,  H01L23/473

Abstract: A cooling fluid circulation module includes: a first surface having a planar form and contacting a heating portion; a second surface opposite to the first surface and having a planar form, the second surface being spaced apart from the first surface; a first cooling channel extending between the first surface and the second surface in a first direction; a cooling fluid provided in the first cooling channel; and a plurality of first protrusions arranged along a plane on the second surface on which the first cooling channel extends, wherein each of the plurality of first protrusions may include a first surface inclined from the second surface by a first angle and a second surface inclined from the second surface by a second angle that is different than the first angle.

公开(公告)号：US20240203821A1

公开(公告)日：2024-06-20

申请号：US18202613

申请日：2023-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Daehyuk SON ,  Seogwoo HONG

IPC: H01L23/427 ,  H01L25/065

CPC classification number: H01L23/427 ,  H01L25/0657 ,  H01L24/16

Abstract: A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel including at least a first portion that is inside the semiconductor chip, a wall surface including a fine pattern configured to generate a capillary force that causes a liquid coolant to flow in the cooling channel, a liquid channel area in a first area of the cooling channel where the fine pattern is formed and configured to pass the liquid coolant, and a gas channel area in a second area of the cooling channel where the fine pattern is not formed and configured to pass a gaseous coolant.

公开(公告)号：US20250125221A1

公开(公告)日：2025-04-17

申请号：US18658593

申请日：2024-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Dongkyun KIM ,  Daehyuk SON ,  Hotaik LEE ,  Seogwoo HONG

IPC: H01L23/473 ,  H01L23/367

Abstract: A semiconductor device includes: a semiconductor chip including a semiconductor integrated circuit; a heat transfer member covering an upper surface of the semiconductor chip; and a plurality of microstructures on an upper surface of the heat transfer member and configured to generate a capillary force to cause a flow of a coolant, wherein a first capillary channel is provided between adjacent microstructures of the plurality of microstructures, and at least one of the plurality of microstructures may include a hollow microstructure in which a second capillary channel is provided.

公开(公告)号：US20240203825A1

公开(公告)日：2024-06-20

申请号：US18206472

申请日：2023-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo HONG ,  Sungchan KANG ,  Daehyuk SON ,  Jeongyub LEE

IPC: H01L23/473 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16221 ,  H01L2924/16151 ,  H01L2924/16152

Abstract: A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit; a cooling channel including a surface of the semiconductor chip and configured to provide a passage for a coolant to cool the semiconductor chip; and a plurality of flexible capillary patterns on the surface of the semiconductor chip inside the cooling channel and configured to move the coolant by capillary action, wherein each capillary pattern of the plurality of flexible capillary patterns may include a first portion in a length direction of the capillary pattern that contacts and is supported by the surface of the semiconductor chip, and a second portion in the length direction that is spaced apart from and unsupported by the surface of the semiconductor chip, and a curvature of the second portion of each capillary pattern of the plurality of flexible capillary patterns changes according to temperature.

公开(公告)号：US20240203824A1

公开(公告)日：2024-06-20

申请号：US18198506

申请日：2023-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehyuk SON ,  Sungchan KANG ,  Seogwoo HONG

IPC: H01L23/473 ,  H10N30/20

CPC classification number: H01L23/473 ,  H10N30/2047

Abstract: A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel formed in the semiconductor chip and providing a moving path for a coolant. An ultrasonic vibrator may be arranged in the cooling channel. The ultrasonic vibrator may vibrate the coolant. By doing so, the stagnation of vapors and/or generation of a vapor film may be reduced or prevented.

公开(公告)号：US20220099828A1

公开(公告)日：2022-03-31

申请号：US17187097

申请日：2021-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Daehyuk SON

IPC: G01S15/08

Abstract: Provided is a distance measurement system, including: at least one sound source configured to generate an acoustic signal; an acoustic sensor including a plurality of directional acoustic sensors arranged to have directionalities different from one another; and at least one processor configured to: obtain a directionality of the acoustic signal in a particular direction based on at least one of a sum of output signals of the plurality of directional acoustic sensors or a difference between the output signals of the plurality of directional acoustic sensors, the at least one of the sum or the difference being based on applying a weight to at least one of the output signals; and determine a distance between the acoustic sensor and a reflection surface based on a time for the acoustic signal to arrive at the acoustic sensor in the particular direction after being generated and then reflected from the reflection surface.