公开(公告)号：US20240255563A1

公开(公告)日：2024-08-01

申请号：US18602717

申请日：2024-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Changkyu CHUNG ,  Kyungwoon JANG ,  Daeseok HWANG

IPC: G01R31/26

CPC classification number: G01R31/2635

Abstract: An electroluminescence inspection apparatus includes a first substrate, and electrode members arranged at a first surface of the first substrate, and electrically contacted respectively with a chip electrode pad of light emitting diodes arranged at a second substrate based on performing an electroluminescence inspection, wherein an electrode member includes contact protrusions configured to be elastically contacted at a chip electrode member of the light emitting diode based on the first substrate is pressed by the second substrate.