公开(公告)号：US20240353764A1

公开(公告)日：2024-10-24

申请号：US18388298

申请日：2023-11-09

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kyung Chin YI ,  Dong Sik Jeong ,  Sun Ho Kim ,  Woo-Hyung Kim ,  Seung Uk Park ,  Yong Hee Lee

IPC分类号： G03F7/00

CPC分类号： G03F7/70916 ,  G03F7/70725 ,  G03F7/70808 ,  G03F7/7095 ,  G03F7/70991

摘要： Provided is a lithography apparatus including a wafer stage, a cable connected to the wafer stage, the cable being configured to bend based on the wafer stage moving, a support unit configured to prevent the cable from sagging, the support unit including a plurality of clamps configured to restrict movement of the cable and a connection member connecting the plurality of clamps to each other, and a protective unit under the cable, the protective unit being configured to collide with the support unit based on the wafer stage moving, wherein the protective unit includes ultra-high molecular weight polyethylene (UHMWPE).