公开(公告)号：US20220246805A1

公开(公告)日：2022-08-04

申请号：US17483118

申请日：2021-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkuk LEE ,  Daesup KIM ,  Dongmyung SHIN ,  Wooseok JANG ,  Sunhwan HWANG

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: A semiconductor light emitting device is provided. The device includes: an LED chip having a lower surface, an upper surface, and a side surface between the upper surface and the lower surface; first and second conductive bumps disposed on first and second conductive bumps provided on the lower surface; a first wavelength conversion layer having a first region provided on the upper surface of the LED chip and a second region which extends past the side surface of the LED chip; a second wavelength conversion layer having a first surface contacting the side surface of the LED chip, a second surface, a third surface connecting the first surface and the second surface, and contacting the second region, and a fourth surface located opposite to the third surface and inclined; and a reflective resin portion provided on the lower surface of the LED chip and the fourth surface.