公开(公告)号：US12278251B2

公开(公告)日：2025-04-15

申请号：US17409888

申请日：2021-08-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyoung Jang ,  Seokho Kim ,  Eungkyu Lee

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor includes a sensor chip and a logic chip. The sensor chip includes a first substrate, an upper bonding layer, a first wiring layer, and the logic chip includes a second substrate, a lower bonding layer, a second wiring layer. The upper and lower bonding layers contact each other, with the upper bonding layer including an upper dielectric layer, an upper conductive pad, an upper shield structure, and an upper wiring line, and the lower bonding layer including a lower dielectric layer, a lower conductive pad, a lower shield structure, and a lower wiring line. The upper wiring line, upper conductive pad, and upper shield structure being one body, and the lower wiring line, lower conductive pad, and lower shield structure being one body, the upper and lower conductive pads overlap and contact each other, and the upper and lower wiring lines overlap and contact each other.

公开(公告)号：US09293494B2

公开(公告)日：2016-03-22

申请号：US14675915

申请日：2015-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungchak Ahn ,  Youngsun Oh ,  Kyungho Lee ,  Dongyoung Jang

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14603 ,  H01L27/14612 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643

Abstract: An image sensor includes a substrate including a pixel region and a peripheral circuit region, and a first device isolation layer disposed in the substrate to define a plurality of unit pixels that are adjacent to each other in a first direction in the pixel region. Each of the plurality of unit pixels includes at least one light sensing element disposed in the substrate. The image sensor includes an interlayer insulating structure on the substrate, and a first blocking structure disposed on the first device isolation layer and penetrating the interlayer insulating structure. The first blocking structure is disposed between the plurality of unit pixels when viewed from a plan view. The first blocking structure extends in a second direction intersecting the first direction when viewed from a plan view.

Abstract translation: 图像传感器包括：基板，包括像素区域和外围电路区域;以及第一器件隔离层，设置在所述基板中，以限定像素区域中沿着第一方向彼此相邻的多个单位像素。 多个单位像素中的每一个包括设置在基板中的至少一个感光元件。 图像传感器包括在基板上的层间绝缘结构，以及设置在第一器件隔离层上并穿透层间绝缘结构的第一阻挡结构。 当从平面图观察时，第一阻挡结构设置在多个单位像素之间。 当从俯视图观察时，第一阻挡结构沿与第一方向交叉的第二方向延伸。