公开(公告)号：US12027549B2

公开(公告)日：2024-07-02

申请号：US17387050

申请日：2021-07-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngwoo Chung ,  Junemo Koo ,  Jinpyo Kim ,  Juneyoung Park ,  Eungkyu Lee ,  Jeongrae Jo

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636

Abstract: Provided is an image sensor including a substrate, in which a pixel area including a plurality of unit pixels, an optical black area located outside of the pixel area, and an alignment key area located outside of the pixel area are included, the substrate having a first surface and a second surface opposing the first surface, an interconnection structure below the first surface of the substrate, photoelectric conversion elements in the pixel area of the substrate, an insulating layer on the second surface of the substrate, a grid layer on the insulating layer in the pixel area and the alignment key area, a key pattern layer between the insulating layer disposed in the alignment key area and the grid layer disposed in the alignment key area, the key pattern layer including a protruding region to correspond to the grid layer, and color filters on the insulating layer and the grid layer in the pixel area.

公开(公告)号：US12278251B2

公开(公告)日：2025-04-15

申请号：US17409888

申请日：2021-08-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyoung Jang ,  Seokho Kim ,  Eungkyu Lee

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor includes a sensor chip and a logic chip. The sensor chip includes a first substrate, an upper bonding layer, a first wiring layer, and the logic chip includes a second substrate, a lower bonding layer, a second wiring layer. The upper and lower bonding layers contact each other, with the upper bonding layer including an upper dielectric layer, an upper conductive pad, an upper shield structure, and an upper wiring line, and the lower bonding layer including a lower dielectric layer, a lower conductive pad, a lower shield structure, and a lower wiring line. The upper wiring line, upper conductive pad, and upper shield structure being one body, and the lower wiring line, lower conductive pad, and lower shield structure being one body, the upper and lower conductive pads overlap and contact each other, and the upper and lower wiring lines overlap and contact each other.

公开(公告)号：US20220231064A1

公开(公告)日：2022-07-21

申请号：US17648294

申请日：2022-01-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGWOO CHUNG ,  Sooeon Kim ,  Jinyoung Kim ,  Hyehi Shin ,  Eungkyu Lee ,  Jeongrae Jo

IPC: H01L27/146

Abstract: An image sensor includes a substrate that includes a plurality of photoelectric conversion devices, an insulating structure disposed on the substrate, a grid pattern structure disposed on the insulating structure, a plurality of color filters disposed on the insulating structure, and a plurality of microlenses disposed on the plurality of color filters. The grid pattern structure includes a first pattern portion and a plurality of second pattern portions spaced apart from the first pattern portion. The first pattern portion is disposed between proximate pairs of color filters among the plurality of color filters. An entire side surface of each second pattern portion of the plurality of second pattern portions is respectively surrounded by a color filter from among the first to third color filters.

公开(公告)号：US20230411422A1

公开(公告)日：2023-12-21

申请号：US18169954

申请日：2023-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hanseok KIM ,  Chanhyeon Seong ,  Eungkyu Lee ,  Jeong-Ho Lee

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14645

Abstract: An image sensor includes a substrate having opposite first and second surfaces and including first to third unit pixels arranged in a first direction, and first and second pixel separation portions in the substrate and between, and separating from each other, separate adjacent unit pixels of the first to third unit pixels. The first pixel separation portion includes a first conductive pattern, and a first separation insulating pattern covering a sidewall of the first conductive pattern. The second pixel separation portion includes a second conductive pattern, and a second separation insulating pattern covering a sidewall of the second conductive pattern. The first conductive pattern has a first width in the first direction, and the second conductive pattern has a second width in the first direction, which is less than the first width.

公开(公告)号：US20220173146A1

公开(公告)日：2022-06-02

申请号：US17387050

申请日：2021-07-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngwoo Chung ,  Junemo Koo ,  Jinpyo Kim ,  Juneyoung Park ,  Eungkyu Lee ,  Jeongrae Jo

IPC: H01L27/146

Abstract: Provided is an image sensor including a substrate, in which a pixel area including a plurality of unit pixels, an optical black area located outside of the pixel area, and an alignment key area located outside of the pixel area are included, the substrate having a first surface and a second surface opposing the first surface, an interconnection structure below the first surface of the substrate, photoelectric conversion elements in the pixel area of the substrate, an insulating layer on the second surface of the substrate, a grid layer on the insulating layer in the pixel area and the alignment key area, a key pattern layer between the insulating layer disposed in the alignment key area and the grid layer disposed in the alignment key area, the key pattern layer including a protruding region to correspond to the grid layer, and color filters on the insulating layer and the grid layer in the pixel area.