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公开(公告)号:US12284843B2
公开(公告)日:2025-04-22
申请号:US17569028
申请日:2022-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngkyu Sung , Dooho Jeong , Myunggoo Cheong , Seungwan Chae
IPC: H01L33/24 , H01L33/22 , H01L33/60 , H01L33/62 , H10H20/82 , H10H20/821 , H10H20/856 , H10H20/857 , H10H29/10 , H10H20/01 , H10H20/825 , H10H20/833
Abstract: A semiconductor light emitting device package includes: a substrate; a first semiconductor layer including first regions including a first-type semiconductor material and having a first height, and a second region disposed between the first regions and having a second height lower than the first height; an active layer including disposed in the first regions, and emitting light of a predetermined wavelength band; a second semiconductor layer disposed on the active layer and formed of a second-type semiconductor material; a third semiconductor layer disposed on the second semiconductor layer, and formed of a second-type semiconductor material different from the second-type semiconductor material of the second semiconductor layer; a transparent electrode layer including disposed on the third semiconductor layer; and a reflective electrode layer electrically connected to the transparent electrode layer, respectively, and including portions overlapping the active layer in a vertical direction and a horizontal direction, respectively.