公开(公告)号：US20180189206A1

公开(公告)日：2018-07-05

申请号：US15844165

申请日：2017-12-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JEONG HO LEE ,  SUNG ROH YOON ,  EUI YOUNG CHUNG ,  JIN WOO KIM ,  YOUNG JIN CHO ,  MYEONG JIN KIM ,  SEI JOON KIM ,  JEONG BIN KIM ,  HYEOK JUN CHOE

IPC: G06F13/16 ,  G06F13/28

Abstract: A semiconductor system includes a CPU connected to a heterogeneous memory module via a system bus. The heterogeneous memory module includes; a volatile memory module, a nonvolatile memory module, an internal bus separate from the system bus and connecting the volatile memory module and the nonvolatile memory module, and a swap manager configured to control execution of a swap operation transferring target data between the volatile memory module and nonvolatile memory module using the internal bus and without using of the system bus.