公开(公告)号：US20130236997A1

公开(公告)日：2013-09-12

申请号：US13791057

申请日：2013-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hyun LEE ,  Gam Han YONG ,  Seong Deok HWANG

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/0079 ,  H01L2224/32225 ,  H01L2933/0033

Abstract: A light emitting device and a method for fabricating the same are provided. The method includes: forming a plurality of light emitting laminates in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially laminated on a growth substrate; mounting the growth substrate on a substrate including a plurality of terminal units each including a pair of electrode terminals; electrically connecting the second conductivity-type semiconductor layer of each of the light emitting laminates to a first electrode terminal of a corresponding terminal unit; removing the growth substrate to expose the first conductivity-type semiconductor layer; forming an insulating layer on a lateral surface of each of the plurality of light emitting laminates; and electrically connecting the exposed first conductivity-type semiconductor layer of each of the light emitting laminates to a second electrode terminal of the corresponding terminal unit.

Abstract translation: 提供一种发光器件及其制造方法。 该方法包括：形成多个发光层压板，其中第一导电类型半导体层，有源层和第二导电类型半导体层依次层压在生长衬底上; 将生长衬底安装在包括多个端子单元的衬底上，每个端子单元包括一对电极端子; 将每个发光层压板的第二导电类型半导体层电连接到相应的端子单元的第一电极端子; 去除所述生长衬底以暴露所述第一导电型半导体层; 在所述多个发光层压板的每一个的侧表面上形成绝缘层; 并且将每个发光层压板的暴露的第一导电类型半导体层电连接到相应的端子单元的第二电极端子。