摘要:
A semiconductor device includes a substrate. A first heat dissipation layer is disposed on the substrate and extends in a first direction. A metal layer is disposed on the first heat dissipation layer and extends in the first direction. A width of the first heat dissipation layer in a second direction intersecting the first direction is greater than a width of the metal layer in the second direction. The first heat dissipation layer has a structure made of carbon atoms and includes at least one among graphene, nanotubes, and a diamond structure.
摘要:
A semiconductor device includes active regions, a gate electrode, respective drain regions, respective source regions, a drain contact structure, a source contact structure, and a gate contact structure. The active regions extend linearly in parallel on a substrate. The gate electrode crosses the active regions. The drain regions are on and/or in the active regions on a first side of the gate electrode. The respective source regions are on and/or in the active regions on a second side of the gate electrode. The drain contact structure is on multiple drain regions. The source contact structure is on multiple source regions. The gate contact structure is on the gate electrode between the drain and source contact structures. The gate contact structure includes a gate plug and an upper gate plug directly on the gate plug. A center of the gate contact structure overlies only one of the active regions.
摘要:
A semiconductor device capable of improving operation performance and reliability, may include a gate insulating support to isolate gate electrodes that are adjacent in a length direction. The semiconductor device includes a first gate structure on a substrate, the first gate structure extending lengthwise in a first direction to have two long sides and two short sides, relative to each other, and including a first gate spacer; a second gate structure on the substrate, the second gate structure extending lengthwise in the first direction to have two long sides and two short sides, relative to each other, and including a second gate spacer, wherein a first short side of the second gate structure faces a first short side of the first gate structure; and a gate insulating support disposed between the first short side of the first gate structure and the first short side of the second gate structure and extending lengthwise in a second direction different from the first direction, a length of the gate insulating support in the second direction being greater than a width of each of the first gate structure and the second gate structure in the second direction.
摘要:
A semiconductor device capable of improving operation performance and reliability, may include a gate insulating support to isolate gate electrodes that are adjacent in a length direction. The semiconductor device includes a first gate structure on a substrate, the first gate structure extending lengthwise in a first direction to have two long sides and two short sides, relative to each other, and including a first gate spacer; a second gate structure on the substrate, the second gate structure extending lengthwise in the first direction to have two long sides and two short sides, relative to each other, and including a second gate spacer, wherein a first short side of the second gate structure faces a first short side of the first gate structure; and a gate insulating support disposed between the first short side of the first gate structure and the first short side of the second gate structure and extending lengthwise in a second direction different from the first direction, a length of the gate insulating support in the second direction being greater than a width of each of the first gate structure and the second gate structure in the second direction.
摘要:
An unmanned aerial vehicle is disclosed. The unmanned aerial vehicle includes a memory, a sensor unit, a camera, a moving unit, and a processor. The sensor unit is configured to sense the unmanned aerial vehicle or a surrounding object. The camera configured to take an image. The moving unit configured to generate power to move the unmanned aerial vehicle. The processor is configured to determine whether a user makes contact with the unmanned aerial vehicle. The processor is also configured to control the moving unit to allow the unmanned aerial vehicle to hover at a second location when the unmanned aerial vehicle is moved from a first location to the second location by an external force of a predetermined magnitude or greater while the contact is maintained.
摘要:
Provided is a microfluidic device that is capable of rapidly performing an in vitro diagnosis and being miniaturized. The microfluidic device includes: a platform which includes a sample injection hole through which a sample may be injected; and a chamber which is formed in the platform and in which a first reagent, which includes target antigens that exist in the sample and antibodies that are specifically combined with the target antigens, and a second reagent, which includes an antigen-enzyme conjugant in which antigens that are specifically combined with the antibodies and enzymes are conjugated, are stored.
摘要:
An apparatus and method using error correcting for visible light communication are provided. The error correction includes generating an encoded message from an original message by using a predetermined coding method, puncturing the encoded message based on a determined dimming value or rate, and/or puncturing rate, generating a scrambled message by scrambling the punctured message, and providing the scrambled message to a visible light source.
摘要:
A semiconductor device includes active regions, a gate electrode, respective drain regions, respective source regions, a drain contact structure, a source contact structure, and a gate contact structure. The active regions extend linearly in parallel on a substrate. The gate electrode crosses the active regions. The drain regions are on and/or in the active regions on a first side of the gate electrode. The respective source regions are on and/or in the active regions on a second side of the gate electrode. The drain contact structure is on multiple drain regions. The source contact structure is on multiple source regions. The gate contact structure is on the gate electrode between the drain and source contact structures. The gate contact structure includes a gate plug and an upper gate plug directly on the gate plug. A center of the gate contact structure overlies only one of the active regions.
摘要:
A semiconductor device with improved product reliability and a method of fabricating the semiconductor are provided. The semiconductor device includes a substrate, a gate electrode on the substrate, a first spacer on a sidewall of the gate electrode, a conductive contact on a sidewall of the first spacer to protrude beyond a top surface of the gate electrode, a trench defined by the top surface of the gate electrode, a top surface of the first spacer, and sidewalls of the contact, an etching stop layer extending along at least parts of sidewalls of the trench and a bottom surface of the trench, and a capping pattern on the etching stop layer to fill the trench, wherein the capping pattern includes silicon oxide or a low-k material having a lower permittivity than silicon oxide.
摘要:
A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.