公开(公告)号：US12057336B2

公开(公告)日：2024-08-06

申请号：US17190885

申请日：2021-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shashank Shrikant Agashe ,  Gaurav Kumar ,  Sathyanarayanan Kulasekaran ,  Chanwoo Park ,  Yunje Cho

IPC: H01L21/67 ,  G01N23/2251 ,  G06T7/00 ,  G06T17/00 ,  G06T19/20

CPC classification number: H01L21/67288 ,  G01N23/2251 ,  G06T7/001 ,  G06T17/00 ,  G06T19/20 ,  G01N2223/07 ,  G01N2223/418 ,  G01N2223/507 ,  G01N2223/6116 ,  G01N2223/646 ,  G06T2207/10061 ,  G06T2207/30148 ,  G06T2219/2016

Abstract: The present disclosure relates to a method for estimating heights of defects in a wafer. The method comprises creating an un-calibrated 3D model of a defect in a wafer, determining one or more attributes associated with the un-calibrated 3D model, transforming the un-calibrated 3D model to a calibrated 3D model, and estimating a height of the defect using the calibrated 3D model. Creating an un-calibrated 3D model corresponds to a defect present in a wafer based on a plurality of Scanning Electron Microscope (SEM) images of the defect. Transforming the un-calibrated 3D model to a calibrated 3D model uses a scaling factor corresponding to the determined one or more attributes associated with the un-calibrated 3D model. A height of the defect is estimated based on the calibrated 3D model of the defect.

公开(公告)号：US10567490B2

公开(公告)日：2020-02-18

申请号：US15261181

申请日：2016-09-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sameera Bharadwaja Hayavadana ,  Gaurav Kumar ,  Rajaneesh Tiwari

IPC: H04L29/08 ,  H04L12/26

Abstract: An apparatus dynamically reallocates resources for optimized job performance in a distributed heterogeneous computer system that includes a plurality of computer nodes. The apparatus includes an application injector to invoke at least one job to be performed on at least one computer node among the computer nodes. The apparatus further includes a collector to dynamically collect a workload value on each computer node. The apparatus further includes a job informer to determine known and unknown jobs on each computer node. The apparatus further includes a job optimizer to determine a data distribution vector based on the workload value and the known and unknown jobs on each computer node. The data distribution vector defines an amount of data to be distributed among the computer nodes to perform the at least one job.

公开(公告)号：US20220189806A1

公开(公告)日：2022-06-16

申请号：US17190885

申请日：2021-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shashank Shrikant Agashe ,  Gaurav Kumar ,  Sathyanarayanan Kulasekaran ,  Chanwoo Park ,  Yunje Cho

IPC: H01L21/67 ,  G06T17/00 ,  G06T19/20 ,  G06T7/00 ,  G01N23/2251

Abstract: The present disclosure relates to a method for estimating heights of defects in a wafer. The method comprises creating an un-calibrated 3D model of a defect in a wafer, determining one or more attributes associated with the un-calibrated 3D model, transforming the un-calibrated 3D model to a calibrated 3D model, and estimating a height of the defect using the calibrated 3D model. Creating an un-calibrated 3D model corresponds to a defect present in a wafer based on a plurality of Scanning Electron Microscope (SEM) images of the defect. Transforming the un-calibrated 3D model to a calibrated 3D model uses a scaling factor corresponding to the determined one or more attributes associated with the un-calibrated 3D model. A height of the defect is estimated based on the calibrated 3D model of the defect.

公开(公告)号：US10521695B2

公开(公告)日：2019-12-31

申请号：US15078314

申请日：2016-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shashank Shrikant Agashe ,  Gaurav Kumar

IPC: G06K9/62 ,  H04N5/232 ,  G06K9/52 ,  H04N5/265 ,  H04N5/369 ,  G02B26/08 ,  H04N17/00

Abstract: The present inventive concepts discloses methods, apparatuses, and/or systems for enabling spatially varying auto focusing of one or more objects using an image capturing system. The methods, apparatuses, and/or systems may include focusing objects in a region of interest using lenses, enabling spatially varying auto focusing of objects in the region of interest using a spatial light modulators (SLM), which are out of focus in the region of interest, and capturing the focused and the auto focused objects in the region of interest using a camera sensor.

公开(公告)号：US12255110B2

公开(公告)日：2025-03-18

申请号：US17341619

申请日：2021-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gaurav Kumar ,  Lakshmi Narayana Pedapudi ,  Sameera Bharadwaja Hayavadana ,  Sathyanarayanan Kulasekaran ,  Shashank Shrikant Agashe ,  Wan Sung Park ,  Sung Ha Kim

IPC: H01L21/66 ,  G01B11/06 ,  G01N21/84 ,  G03F7/16 ,  G03F7/30 ,  G06T7/00 ,  H01L21/67 ,  H01L21/02

Abstract: Example embodiments may provide methods for determining a quality of a film in spin coating process. The methods may include capturing images of portions of the film using an imaging device while coating the film on a substrate using a spinner. The imaging device may include SPCs and lens and/or SLMs. The methods may also include determining whether a characteristic of the film matches to a standard based on the images of the portions of the film. The method may further include performing detecting that the quality of the film is optimal in response to determining that the characteristic of the film matches to the standard or detecting that the quality of the film is not optimal in response to determining that the characteristic of the film does not match to the standard.

公开(公告)号：US11639906B2

公开(公告)日：2023-05-02

申请号：US17185559

申请日：2021-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shashank Shrikant Agashe ,  Gaurav Kumar ,  Priya Ranjan Sinha ,  Lakshmi Narayana Pedapudi ,  Avadhut Dipakrao Chaudhari ,  Dongwoo Lee ,  Taehyoung Lee

IPC: H01J37/09 ,  G01N23/2273 ,  G01N23/2251

Abstract: Provided is a method for virtually executing an operation of an energy dispersive x-ray spectrometry (EDS) system in real time production line by analyzing a defect included in a material undergoing inspection based on computer vision, the method including receiving a scanning electron microscope (SEM) image of the material including the defect, extracting an image-feature from the SEM image of the material, classifying the extracted image-feature under a predetermined label, predicting, based on the classified image-feature, an element associated with the defect included in the material and a shape of the predicted element, and grading the defect included in the material based on comparing the predicted element with a predetermined criteria.