公开(公告)号：US10692833B2

公开(公告)日：2020-06-23

申请号：US15463061

申请日：2017-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Cheol Kim ,  Gil-Man Kang ,  Kyoung-Bok Cho ,  Yong-Dae Ha

IPC: H01L21/00 ,  H01L23/00

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.