公开(公告)号：US10692833B2

公开(公告)日：2020-06-23

申请号：US15463061

申请日：2017-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Cheol Kim ,  Gil-Man Kang ,  Kyoung-Bok Cho ,  Yong-Dae Ha

IPC: H01L21/00 ,  H01L23/00

Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.

公开(公告)号：US11482505B2

公开(公告)日：2022-10-25

申请号：US16582405

申请日：2019-09-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Cheol Kim ,  Gil Man Kang ,  Yong Dae Ha

IPC: H01L23/00

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.