公开(公告)号：US20230341776A1

公开(公告)日：2023-10-26

申请号：US18106254

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HOYOUNG KIM ,  Youngkwan LEE ,  SOOCHAN KIM ,  Hyungjun CHEE ,  HYUNWOO KIM ,  SONGSE YI

IPC: G03F7/06 ,  C07F1/00

CPC classification number: G03F7/06 ,  C07F1/005

Abstract: A resist compound is represented by Formula 1:




wherein R1 is an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 1 to 12 carbon atoms, or a hydrocarbon ring group having 3 to 12 carbon atoms, and A bonded to R1 is O or NR2, wherein R2 is hydrogen, an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 1 to 12 carbon atoms, or a hydrocarbon ring group having 3 to 12 carbon atoms. A resist composition includes the resist compound and an organic solvent. A method for forming a resist pattern includes forming a resist layer by applying the resist composition including the resist compound on a substrate, irradiating light onto the resist layer to provide an irradiated resist layer, and developing the irradiated resist layer to form a resist pattern.