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公开(公告)号:US20240250001A1
公开(公告)日:2024-07-25
申请号:US18532186
申请日:2023-12-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: HOYOUNG TANG , TAE-HYUNG KIM , JUNGHO DO
IPC: H01L23/48 , H01L27/092 , H01L29/06 , H01L29/417 , H01L29/423 , H01L29/66 , H01L29/775 , H01L29/786
CPC classification number: H01L23/481 , H01L27/092 , H01L29/0673 , H01L29/41733 , H01L29/41775 , H01L29/42392 , H01L29/66545 , H01L29/775 , H01L29/7869
Abstract: A semiconductor device including: first and second transistors on a substrate; an isolation transistor provided between the first and second transistors; a lower power line in a lower portion of the substrate; and a back-side gate contact penetrating the substrate and connected to the lower power line and a dummy gate electrode of the isolation transistor.