公开(公告)号：US20200373274A1

公开(公告)日：2020-11-26

申请号：US16783342

申请日：2020-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung HAN ,  Taeyeong KIM ,  Jihoon KANG ,  Nohsung KWAK ,  Seokho KIM ,  Hoechul KIM ,  Ilhyoung LEE ,  Hakjun LEE

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.