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公开(公告)号：US20210358778A1
公开(公告)日：2021-11-18
申请号：US17078190
申请日：2020-10-23
发明人： Ilyoung HAN , Kyoungran KIM , Chulhyun PARK , Minjae SHIN , Geunsik OH , Hyunjin LEE , Soonwon LEE , Nungpyo HONG
IPC分类号： H01L21/67 , H01L21/683 , H01L23/00
摘要： A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.
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公开(公告)号：US20210035830A1
公开(公告)日：2021-02-04
申请号：US16821415
申请日：2020-03-17
发明人： Kwangnam KIM , Nohsung KWAK , Sungyeon KIM , Hyungjun KIM , Haejoong PARK , Jongwoo SUN , Sangrok OH , Ilyoung HAN , Jungpyo HONG
IPC分类号： H01L21/67 , H01L21/687 , H01L21/673 , H01L21/677
摘要： A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.
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公开(公告)号：US20200373274A1
公开(公告)日：2020-11-26
申请号：US16783342
申请日：2020-02-06
发明人： Ilyoung HAN , Taeyeong KIM , Jihoon KANG , Nohsung KWAK , Seokho KIM , Hoechul KIM , Ilhyoung LEE , Hakjun LEE
IPC分类号： H01L23/00 , H01L21/683 , H01L21/687 , H01L21/67
摘要： A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.
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公开(公告)号：US20230253236A1
公开(公告)日：2023-08-10
申请号：US18135017
申请日：2023-04-14
发明人： Ilyoung HAN , Hunyong PARK , Sohee HAN , Nohsung KWAK
IPC分类号： H01L21/687
CPC分类号： H01L21/68742 , H01L21/68785
摘要： The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.
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公开(公告)号：US20210005504A1
公开(公告)日：2021-01-07
申请号：US16712413
申请日：2019-12-12
发明人： Ilyoung HAN , Hunyong PARK , Sohee HAN , Nohsung KWAK
IPC分类号： H01L21/687
摘要： The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.
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