公开(公告)号：US11640943B2

公开(公告)日：2023-05-02

申请号：US17464151

申请日：2021-09-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-A Lee ,  Yeon Sook Kim ,  Han Byul Jang

IPC: H01L23/544 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor wafer includes a wafer body including an active layer having a first crystal orientation and having first and second surfaces opposing each other, and a support layer having a second crystal orientation different from the first crystal orientation and having third and fourth surfaces opposing each other, a bevel portion that extends along an outer periphery of the wafer body to connect the first surface to the fourth surface, and a notch portion formed at a predetermined depth in a direction from the outer periphery of the wafer body toward a center portion of the wafer body. The bevel portion includes a first beveled surface connected to the first surface and a second beveled surface connected to the fourth surface. The first beveled surface has a width in a radial direction of the wafer body that is 300 μm or less.