公开(公告)号：US20240222241A1

公开(公告)日：2024-07-04

申请号：US18380361

申请日：2023-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hyun LEE ,  Han Sung RYU ,  Jun Ho LEE

IPC: H01L23/498 ,  H01L23/538 ,  H01L25/10

CPC classification number: H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L25/105 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor package includes a first substrate. Solder balls are disposed on a lower surface of the first substrate. A first semiconductor chip is on an upper surface of the first substrate. The solder balls include a first ball disposed in a first direction from a center of the first substrate and spaced apart from the center by a first distance. A second ball is disposed in a third direction from the center between the first and second directions and is spaced apart from the center by a second distance less than or equal to the first distance. A first pitch between the first ball and a first adjacent ball disposed immediately to an outer side in the first direction is less than a second pitch between the first ball and a second adjacent ball disposed immediately adjacent to an inner side in the first direction.