公开(公告)号：US20240186289A1

公开(公告)日：2024-06-06

申请号：US18226990

申请日：2023-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hanmin Lee ,  Unbyoung Kang ,  Seongyo Kim ,  Sangsick Park

IPC: H01L25/065 ,  H01L21/461 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H10B80/00

CPC classification number: H01L25/0657 ,  H01L21/461 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/32 ,  H01L25/50 ,  H10B80/00 ,  H01L2224/16145 ,  H01L2224/32145

Abstract: A method of manufacturing a semiconductor package comprises stacking, via an adhesive member, a plurality of memory dies to form a memory die stack on a buffer die; forming a first molding member on the buffer die to cover the memory die stack; polishing an upper surface of the first molding member to expose an upper surface of an uppermost memory die in the memory die stack, the uppermost memory die positioned in an uppermost layer in the memory die stack; removing edge portions of the uppermost memory die together with at least a portion of the first molding member and at least a portion of the adhesive member to form a stepped portion; and forming a second molding member on the first molding member to cover the stepped portion of the uppermost memory die.