公开(公告)号：US20240395594A1

公开(公告)日：2024-11-28

申请号：US18539834

申请日：2023-12-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hungsuk YOU ,  Heejung Cho ,  Bumsoo Song ,  Kyoungran Kim ,  Joongha Lee

IPC: H01L21/683 ,  H01L21/68

Abstract: An apparatus for chucking a wafer, the apparatus including a vacuum chuck arranged under the wafer with a ring frame to fix the wafer using vacuum, a plurality of clampers directly making contact with the ring frame to downwardly compress the ring frame in a vertical direction, and a plurality of alignment blocks pushing the ring frame toward a central portion of the wafer in a horizontal direction to align the wafer.