公开(公告)号：US20240347370A1

公开(公告)日：2024-10-17

申请号：US18542172

申请日：2023-12-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongjoon Lee ,  Kyoungran Kim ,  Kwanghyeon Jeong ,  Myeongock Ko ,  Jaeuk Sim ,  Seongbeom Lee ,  Daesung Jung

IPC: H01L21/687 ,  H01L21/66 ,  H05F3/06

CPC classification number: H01L21/68742 ,  H01L22/14 ,  H05F3/06

Abstract: A carrier dechucking system includes a work carrier including a substrate having a first surface, an opposite second surface with a support film attached, and a ring frame surrounding the substrate. The work carrier is placed on a placement table having a support surface on which a lower surface of the support film is maintained, lifting pins configured to move the work carrier, an ionizer configured to eject ions to the lower surface, and a controller. The controller is configured to control the lifting pins to move the work carrier from the support surface to first and second levels, and to control the ionizer to remove static electricity charged on the support film from the support surface to the first level. At the first level, a surface voltage of the first surface of the substrate is lower than a surface voltage of the lower surface of the support film.

公开(公告)号：US20240395594A1

公开(公告)日：2024-11-28

申请号：US18539834

申请日：2023-12-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hungsuk YOU ,  Heejung Cho ,  Bumsoo Song ,  Kyoungran Kim ,  Joongha Lee

IPC: H01L21/683 ,  H01L21/68

Abstract: An apparatus for chucking a wafer, the apparatus including a vacuum chuck arranged under the wafer with a ring frame to fix the wafer using vacuum, a plurality of clampers directly making contact with the ring frame to downwardly compress the ring frame in a vertical direction, and a plurality of alignment blocks pushing the ring frame toward a central portion of the wafer in a horizontal direction to align the wafer.

公开(公告)号：US11581202B2

公开(公告)日：2023-02-14

申请号：US17078190

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Chulhyun Park ,  Minjae Shin ,  Geunsik Oh ,  Hyunjin Lee ,  Soonwon Lee ,  Nungpyo Hong

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

公开(公告)号：US09553069B2

公开(公告)日：2017-01-24

申请号：US14852825

申请日：2015-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Donggil Shim ,  Geunsik Oh ,  Youngjoo Lee ,  Junho Lee ,  Sukwon Lee

IPC: B23K37/04 ,  H01L23/00 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K3/087 ,  B23K37/04 ,  H01L2224/75252 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/7598

Abstract: A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.

Abstract translation: 基板制造装置的接合装置包括上层，与上层相对的下层，其构造为专用于支撑半导体芯片堆叠的被处理基板（设置），以及用于升高下层相对的升降机构 以提供将基板和芯片彼此挤压的压力。