公开(公告)号：US20240395594A1

公开(公告)日：2024-11-28

申请号：US18539834

申请日：2023-12-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hungsuk YOU ,  Heejung Cho ,  Bumsoo Song ,  Kyoungran Kim ,  Joongha Lee

IPC: H01L21/683 ,  H01L21/68

Abstract: An apparatus for chucking a wafer, the apparatus including a vacuum chuck arranged under the wafer with a ring frame to fix the wafer using vacuum, a plurality of clampers directly making contact with the ring frame to downwardly compress the ring frame in a vertical direction, and a plurality of alignment blocks pushing the ring frame toward a central portion of the wafer in a horizontal direction to align the wafer.

公开(公告)号：US11837573B2

公开(公告)日：2023-12-05

申请号：US17166805

申请日：2021-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Joongha Lee ,  Sangha Park ,  Sunghyup Kim ,  Kyeongbin Lim

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75502 ,  H01L2924/3511

Abstract: A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.

公开(公告)号：US20210398935A1

公开(公告)日：2021-12-23

申请号：US17166805

申请日：2021-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Joongha Lee ,  Sangha Park ,  Sunghyup Kim ,  Kyeongbin Lim

IPC: H01L23/00

Abstract: A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.