SUBSTRATE PROCESSING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240060185A1

    公开(公告)日:2024-02-22

    申请号:US18231400

    申请日:2023-08-08

    CPC classification number: C23C16/482 C23C16/4585

    Abstract: A substrate processing apparatus includes a chamber including a susceptor to support a substrate, a reflective housing outside the chamber, a light source in the reflective housing, the light source being configured to emit a light toward the susceptor, and a light adjuster between the light source and the susceptor, the light adjuster including a support portion supported inside the chamber and a lens coupled to the support portion, and the lens including a transmission portion configured to transmit the light and a scattering pattern portion configured to scatter the light.

    SUBSTRATE PROCESSING APPARATUS AND DRIVING METHOD THEREOF

    公开(公告)号:US20230253236A1

    公开(公告)日:2023-08-10

    申请号:US18135017

    申请日:2023-04-14

    CPC classification number: H01L21/68742 H01L21/68785

    Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

    SUBSTRATE PROCESSING APPARATUS AND DRIVING METHOD THEREOF

    公开(公告)号:US20210005504A1

    公开(公告)日:2021-01-07

    申请号:US16712413

    申请日:2019-12-12

    Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

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