公开(公告)号：US20210028034A1

公开(公告)日：2021-01-28

申请号：US16751882

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sungyong PARK ,  Eunseok SEO ,  Hyeongseok JO ,  Seok HEO

IPC: H01L21/67 ,  G05B19/418 ,  G05D23/19 ,  G05D16/20 ,  H05B1/02

Abstract: A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.