公开(公告)号：US20180128758A1

公开(公告)日：2018-05-10

申请号：US15483776

申请日：2017-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ga Hee KIM ,  Young Suk JUNG ,  Yoo Seong YANG ,  Young Hoon LEE ,  Hyun Mi LEE

IPC: G01N25/16 ,  G01B5/30

CPC classification number: G01N25/16 ,  G01B5/30

Abstract: A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (Δh) of the specimen.