公开(公告)号：US20240248053A1

公开(公告)日：2024-07-25

申请号：US18412662

申请日：2024-01-15

申请人： OKUMA CORPORATION

发明人： Reiji KANBE ,  Misaki HIDA

IPC分类号： G01N25/16

CPC分类号： G01N25/16

摘要： A thermal displacement estimating method includes: detecting each temperature of a predetermined heat generating portion and a predetermined main body structure portion by a temperature measurement device; and estimating a thermal displacement of the heat generating portion by an estimation model based on a detected temperature. The estimating of the thermal displacement includes: obtaining a conversion coefficient equivalent temperature change amount equivalent to a change amount of a conversion coefficient before and after a cooling capacity change from a relationship between a predetermined cooling heat amount of a cooling device and the conversion coefficient between the temperature and the displacement for estimating the thermal displacement from the detected temperature and/or a cooling heat amount equivalent temperature change amount equivalent to a changed heat amount before and after the cooling capacity change from a relationship between the predetermined cooling heat amount and a temperature equivalent to the cooling heat amount.

公开(公告)号：US11747256B2

公开(公告)日：2023-09-05

申请号：US17249849

申请日：2021-03-16

申请人： Battelle Energy Alliance, LLC

发明人： Gregory G. Galbreth ,  Ammon N. Williams

IPC分类号： G01N9/28 ,  G01F23/16 ,  G01N13/02 ,  G01N25/16

CPC分类号： G01N13/02 ,  G01F23/165 ,  G01F23/168 ,  G01N9/28 ,  G01N25/16 ,  G01N2013/0266

摘要： A triple bubbler system includes a first fluid probe, a second fluid probe, a third fluid probe, a gas source operably coupled to the first fluid probe, the second fluid probe, and the third fluid probe and configured to meter gas through the first fluid probe, the second fluid probe, and the third fluid probe to form bubbles at tips of each of the first fluid probe, the second fluid probe, and the third fluid probe, and a cover member disposed over the tips of the first, second, and third fluid probes and configured to at least partially prevent bubbles formed and escaping the tips of the first, second, and third fluid probes from interfering with other bubbles formed at each other tips. The bubbler system includes a thermocouple having a plurality of junctions disposed along an axis parallel to longitudinal axes of the first, second, and third fluid probes.

公开(公告)号：US20180275629A1

公开(公告)日：2018-09-27

申请号：US15923534

申请日：2018-03-16

申请人： FANUC CORPORATION

发明人： Mitsunori WATANABE

IPC分类号： G05B19/404 ,  G01K3/00

CPC分类号： G05B19/404 ,  G01K3/00 ,  G01K13/00 ,  G01N25/16 ,  G05B2219/32335 ,  G05B2219/33034 ,  G05B2219/49219

摘要： A machine learning device includes: a measured data acquisition unit that acquires a measured data group; a thermal displacement acquisition unit that acquires a thermal displacement actual measured value about a machine element; a storage unit that uses the measured data group acquired by the measured data acquisition unit as input data, uses the thermal displacement actual measured value about the machine element acquired by the thermal displacement acquisition unit as a label, and stores the input data and the label in association with each other as teaching data; and a calculation formula learning unit that performs machine learning based on the measured data group and the thermal displacement actual measured value about the machine element, thereby setting a thermal displacement estimation calculation formula used for calculating the thermal displacement of the machine element based on the measured data group.

公开(公告)号：US20180149528A1

公开(公告)日：2018-05-31

申请号：US15575981

申请日：2016-05-19

申请人： Hifi Engineering Inc.

发明人： John HULL ,  Seyed Ehsan JALILIAN

IPC分类号： G01K11/32 ,  G01K1/20 ,  G01B11/16 ,  G01N25/16 ,  G01H9/00

CPC分类号： G01K11/32 ,  G01B11/161 ,  G01H9/004 ,  G01K1/20 ,  G01N21/45 ,  G01N25/16

摘要： Described are methods and systems using optical fiber interferometry to sense interference causing events in a region of interest and differentiate between a strain event and a thermal event. Other methods and systems relate to the use of optical fiber interferometry for determining temperature offset in a region of interest and using the determined temperature offset for determining temperature in the region of interest.

公开(公告)号：US20180128758A1

公开(公告)日：2018-05-10

申请号：US15483776

申请日：2017-04-10

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ga Hee KIM ,  Young Suk JUNG ,  Yoo Seong YANG ,  Young Hoon LEE ,  Hyun Mi LEE

IPC分类号： G01N25/16 ,  G01B5/30

CPC分类号： G01N25/16 ,  G01B5/30

摘要： A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (Δh) of the specimen.

公开(公告)号：US09945799B2

公开(公告)日：2018-04-17

申请号：US14670719

申请日：2015-03-27

申请人： FANUC CORPORATION

发明人： Yasuaki Koyama ,  Susumu Maekawa

IPC分类号： G01N25/16 ,  G01M99/00 ,  G05B19/404

CPC分类号： G01N25/16 ,  G01M99/002 ,  G05B19/404 ,  G05B2219/49207

摘要： A thermal displacement correction device for a machine tool is provided with detection result determination unit configured to determine, based on an actual position and a reference position detected by position detection unit, whether or not the actual position is based on correct detection, correction error calculation unit configured to calculate a correction error in the actual position if it is determined that the result of detection is based on correct detection, and correction amount modification unit configured to modify a thermal displacement correction amount based on the correction error.

公开(公告)号：US20170003236A1

公开(公告)日：2017-01-05

申请号：US15201737

申请日：2016-07-05

申请人： Netzsch-Gerätebau GmbH

发明人： Elena Moukhina ,  Doreen Rapp ,  Markus Meyer ,  Thilo Hilpert ,  Martin Hager ,  Fabian Wohlfahrt

IPC分类号： G01N25/16

CPC分类号： G01N25/16

摘要： A method for the thermomechanical analysis of a sample (P) of a material including (a) controlling the temperature of the sample (P), (b) recording data representative for a length variation (dL) of the sample (P), (c) evaluating the data in order to determine a reversible component (dLrev), (d) calculating a corrected reversible component (dLrev-corr; αrev-corr) and/or of the coefficient of thermal expansion (α).

摘要翻译： 一种用于材料样品（P）的热机械分析的方法，包括（a）控制样品（P）的温度，（b）记录代表样品（P）的长度变化（dL）的数据（ c）评估数据以确定可逆分量（dLrev），（d）计算校正的可逆分量（dLrev-corr;αrev-corr）和/或热膨胀系数（α）。

公开(公告)号：US20160379905A1

公开(公告)日：2016-12-29

申请号：US14988747

申请日：2016-01-06

申请人： Winbond Electronics Corp.

发明人： Chien-Chang Chen ,  Horng-Shing Lu

IPC分类号： H01L21/66 ,  G01N27/00 ,  G01L1/00 ,  G01N25/00

CPC分类号： H01L22/30 ,  G01L1/005 ,  G01N25/00 ,  G01N25/16 ,  G01N27/00 ,  H01L22/12

摘要： A method for estimating stress of an electronic component. An electronic component including first and second elements and conductive bumps is provided. Each conductive bump has two surfaces connected to the first and second elements respectively. Two adjacent conductive bumps have a pitch therebetween. The conductive bumps includes a first conductive bump and second conductive bumps. A stress value of the first conductive bump related to a testing parameter is calculated. A stress value of each second conductive bump related to the testing parameter is calculated according to a first calculating formula. The first calculating formula is σ 2 = L D - 2  r  σ 1 , σ2 is the stress of each second conductive bump, L is a beeline distance between each second conductive bump and the first conductive bump, D is an average value of the pitches of the conductive bumps, r is a radius of each surface, and σ1 is the stress value of the first conductive bump.

摘要翻译： σ2是每个第二导电凸块的应力，L是每个第二导电凸块和第一导电凸块之间的直线距离，D是导电凸块的间距的平均值，r是每个表面的半径，σ1是 第一导电凸块的应力值。

公开(公告)号：US20150098485A1

公开(公告)日：2015-04-09

申请号：US14505363

申请日：2014-10-02

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Yves PONTILLON ,  Eric HANUS ,  Helene CAPDEVILA

IPC分类号： G21C17/00 ,  G21C17/112 ,  G01N1/44

CPC分类号： G21C17/001 ,  G01N1/44 ,  G01N25/16 ,  G21C17/06 ,  G21C17/112 ,  G21C19/08

摘要： An assembly comprising a sample and a device for generating a high temperature gradient in said sample comprises: a chamber inside which the sample is placed; a resistor passing through the sample; first inductive means at the periphery of the chamber, for creating an electromagnetic field; and second inductive means that are arranged inside the chamber and connected to the resistor, and that are capable of picking up said electromagnetic field so as to make an induced current flow through said resistor, the chamber being transparent and the first inductive means comprising at least one first coil at least one coil of which contains windings separated by at least 2 mm, this separation being configured to allow an optical means for measuring deformation to be targeted.

摘要翻译： 包括样品和用于在所述样品中产生高温梯度的装置的组件包括：其中放置样品的室; 通过样品的电阻器; 在室的周边处的第一感应装置，用于产生电磁场; 以及第二电感装置，其布置在室内并连接到电阻器，并且能够拾取所述电磁场以使感应电流流过所述电阻器，所述室是透明的，并且所述第一感应装置至少包括 一个第一线圈，其至少一个线圈包含至少2mm间隔的绕组，该间隔被配置为允许用于测量变形的光学装置为目标。

公开(公告)号：US20130098176A1

公开(公告)日：2013-04-25

申请号：US13277246

申请日：2011-10-20

申请人： William E. Bernier ,  Timothy H. Daubenspeck ,  Virendra R. Jadhav ,  Valerie A. Oberson ,  David L. Questad

发明人： William E. Bernier ,  Timothy H. Daubenspeck ,  Virendra R. Jadhav ,  Valerie A. Oberson ,  David L. Questad

IPC分类号： G01N33/00

CPC分类号： H01L22/30 ,  B05D1/36 ,  G01N3/60 ,  G01N19/04 ,  G01N25/16 ,  G01N2203/0296 ,  G01N2203/0298 ,  H01L24/13 ,  H01L2224/131 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00

摘要： A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.

摘要翻译： 公开了一种对称的平板层压结构，用于使测试结构中的变量最小化，以实验测量白色凸起对CTE不匹配的敏感性。 测试结构包括平板层压结构。 使用测试结构的方法包括隔离多变量芯片连接问题的原因，其由翘曲不利地影响并量化翘曲的贡献本身在多变量芯片连接问题的形成中。