公开(公告)号：US20220084812A1

公开(公告)日：2022-03-17

申请号：US17318629

申请日：2021-05-12

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sung Hyun Park ,  Seo Hyun Kim ,  Seung Ho Kim ,  Young Chan Kim ,  Young-Hoo Kim ,  Tae-Hong Kim ,  Hyun Woo Nho ,  Seung Min Shin ,  Kun Tack Lee ,  Hun Jae Jang

IPC分类号： H01L21/02 ,  H01L21/67 ,  G03F7/30 ,  G03F7/20

摘要： A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.