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公开(公告)号：US11648594B2
公开(公告)日：2023-05-16
申请号：US16890490
申请日：2020-06-02
发明人： Seung Min Shin , Hun Jae Jang , Seok Hoon Kim , Young-Hoo Kim , In Gi Kim , Tae-Hong Kim , Kun Tack Lee , Ji Hoon Cha , Yong Jun Choi
IPC分类号： B08B7/00 , B08B3/10 , H01L21/67 , H01L21/687 , H01L21/311
CPC分类号： B08B7/0042 , B08B3/10 , B08B7/0064 , H01L21/31111 , H01L21/67051 , H01L21/67075 , H01L21/67098 , H01L21/67248 , H01L21/68764
摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
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公开(公告)号：US20220084812A1
公开(公告)日：2022-03-17
申请号：US17318629
申请日：2021-05-12
发明人： Sung Hyun Park , Seo Hyun Kim , Seung Ho Kim , Young Chan Kim , Young-Hoo Kim , Tae-Hong Kim , Hyun Woo Nho , Seung Min Shin , Kun Tack Lee , Hun Jae Jang
摘要： A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
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公开(公告)号：US11087996B2
公开(公告)日：2021-08-10
申请号：US16371461
申请日：2019-04-01
发明人： Seung-Min Shin , Seok-Hoon Kim , Young-Hoo Kim , In-Gi Kim , Tae-Hong Kim , Sung-Hyun Park , Jin-Woo Lee , Ji-Hoon Cha , Yong-Jun Choi
IPC分类号： H01L21/67 , H01L21/02 , H01J37/32 , G02B27/09 , B23K26/352 , B08B7/00 , H01L29/66 , H01L27/11556 , H01L27/11582
摘要： A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
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公开(公告)号：US10480111B2
公开(公告)日：2019-11-19
申请号：US14594435
申请日：2015-01-12
发明人： Myung-Seob Song , Dae Wook Park , Soon Cheol Kweon , Seung Kyung Park , Ho-Young Kim , Tae-Hong Kim , Junhee Choi
摘要： A washing machine includes a tub; a drum rotatably disposed inside the tub; and an ultrasound generator configured to emit ultrasonic waves to washing water loaded in the drum, and to generate bubbles. The ultrasound generator applies ultrasonic energy to the washing water to cause chaotic oscillation of the bubbles.
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公开(公告)号：US12042828B2
公开(公告)日：2024-07-23
申请号：US18299279
申请日：2023-04-12
发明人： Seung Min Shin , Hun Jae Jang , Seok Hoon Kim , Young-Hoo Kim , In Gi Kim , Tae-Hong Kim , Kun Tack Lee , Ji Hoon Cha , Yong Jun Choi
IPC分类号： B08B7/00 , B08B3/10 , H01L21/311 , H01L21/67 , H01L21/687
CPC分类号： B08B7/0042 , B08B3/10 , B08B7/0064 , H01L21/31111 , H01L21/67051 , H01L21/67075 , H01L21/67098 , H01L21/67248 , H01L21/68764
摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
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公开(公告)号：US20230249230A1
公开(公告)日：2023-08-10
申请号：US18299279
申请日：2023-04-12
发明人： Seung Min SHIN , Hun Jae Jang , Seok Hoon Kim , Young-Hoo Kim , In Gi Kim , Tae-Hong Kim , Kun Tack Lee , Ji Hoon Cha , Yong Jun Choi
IPC分类号： B08B7/00 , B08B3/10 , H01L21/67 , H01L21/687 , H01L21/311
CPC分类号： B08B7/0042 , B08B3/10 , B08B7/0064 , H01L21/67051 , H01L21/67075 , H01L21/67248 , H01L21/68764 , H01L21/31111 , H01L21/67098
摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
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7.发明公开公开(公告)号：US20230162970A1
公开(公告)日：2023-05-25
申请号：US18158276
申请日：2023-01-23
发明人： Ho-Young KIM , Chae Lyung Kim , Tae-Hong Kim , Yungjun Kim , Boun Yoon , Sol Han , Joonoh Kim
CPC分类号： H01L21/02057 , B08B3/024 , B08B5/02 , H01L21/67051 , B05B1/14 , B05B7/08 , B05B7/0075
摘要： A cleaning apparatus includes a gas supply line and a cleaning liquid supply line. A nozzle is connected to the gas and the cleaning liquid supply lines. The nozzle applies the cleaning liquid to a substrate. A gas entrance port at a top of a body of the nozzle is connected to the gas supply line. A first cleaning liquid entrance port is disposed on a sidewall of the nozzle body and is connected to the cleaning liquid supply line. A fluid injection port is disposed at a bottom of the nozzle body and discharges both the gas and the cleaning liquid. An internal passage of the nozzle body connects each of the gas entrance port and the first cleaning liquid entrance port to the fluid injection port. The fluid injection port has a diameter that is greater than a diameter of the first cleaning liquid entrance port.
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公开(公告)号：US20220165562A1
公开(公告)日：2022-05-26
申请号：US17650710
申请日：2022-02-11
发明人： Ho-Young Kim , Chae Lyoung Kim , Tae-Hong Kim , Youngjun Kim , Boun Yoon , Sol Han , Joonoh Kim
摘要： A cleaning apparatus includes a gas supply line and a cleaning liquid supply line. A nozzle is connected to the gas and the cleaning liquid supply lines. The nozzle applies the cleaning liquid to a substrate. A gas entrance port at a top of a body of the nozzle is connected to the gas supply line. A first cleaning liquid entrance port is disposed on a sidewall of the nozzle body and is connected to the cleaning liquid supply line. A fluid injection port is disposed at a bottom of the nozzle body and discharges both the gas and the cleaning liquid. An internal passage of the nozzle body connects each of the gas entrance port and the first cleaning liquid entrance port to the fluid injection port. The fluid injection port has a diameter that is greater than a diameter of the first cleaning liquid entrance port.
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公开(公告)号：US09576591B2
公开(公告)日：2017-02-21
申请号：US14023852
申请日：2013-09-11
发明人： Tae-Hong Kim
CPC分类号： G10L21/06 , G08C17/02 , G08C23/04 , G08C2201/31 , G10L2015/223
摘要： An electronic apparatus includes a voice acquirer which receives a first voice, a voice processor which processes a voice signal, a communication unit which communicates with at least one external electronic apparatus and receives information on at least one second voice, and a controller which determines whether the first voice is a user's command based on the information on at least one second voice transmitted by the communication unit, and if the first voice is not the user's command, does not perform an operation according to the first voice.
摘要翻译： 电子设备包括：接收第一语音的语音获取器，处理语音信号的语音处理器，与至少一个外部电子设备进行通信并与至少一个第二语音相关的信息的通信单元;以及控制器，其确定是否 第一语音是基于由通信单元发送的至少一个第二语音的信息的用户命令，并且如果第一语音不是用户的命令，则不执行根据第一语音的操作。
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公开(公告)号：US11742221B2
公开(公告)日：2023-08-29
申请号：US17376369
申请日：2021-07-15
发明人： Seung-Min Shin , Seok-Hoon Kim , Young-Hoo Kim , In-Gi Kim , Tae-Hong Kim , Sung-Hyun Park , Jin-Woo Lee , Ji-Hoon Cha , Yong-Jun Choi
IPC分类号： H01L21/67 , H01L21/02 , H01J37/32 , G02B27/09 , B23K26/352 , B08B7/00 , H01L29/66 , H10B41/27 , H10B43/27
CPC分类号： H01L21/67034 , B08B7/0042 , B23K26/352 , G02B27/0955 , H01J37/3244 , H01J37/32568 , H01L21/02098 , H01J2237/335 , H01L29/66545 , H01L29/66795 , H10B41/27 , H10B43/27
摘要： A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.
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