公开(公告)号：US09955948B2

公开(公告)日：2018-05-01

申请号：US14728341

申请日：2015-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan Kang ,  Byunggil Jeong ,  Sangha Park ,  Hyungjae Shin

IPC: A61B8/00 ,  B06B1/02

CPC classification number: A61B8/4444 ,  A61B2562/166 ,  B06B1/0292 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) probes that use wire bonding. A CMUT probe includes a CMUT chip which includes a plurality of first electrode pads which are disposed on a first surface thereof, a printed circuit board (PCB) which is disposed on the first surface of the CMUT chip and which is configured to expose the plurality of first electrode pads, a plurality of second electrode pads which are disposed on the PCB and which correspond to respective ones of the plurality of first electrode pads, and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.