公开(公告)号：US20230005883A1

公开(公告)日：2023-01-05

申请号：US17857651

申请日：2022-07-05

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hyunkeun Kim ,  Yunrae Cho ,  Seungduk Baek

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L23/13 ,  H01L25/18 ,  H01L23/538

摘要： A semiconductor package is provided that includes: a package substrate; an interposer mounted on the package substrate; a first semiconductor chip mounted on the interposer; a plurality of second semiconductor chips mounted on the interposer to surround at least a portion of the first semiconductor chip; a heat radiation member arranged on the first semiconductor chip and the plurality of second semiconductor chips; and a heat blocking member extending from a portion of the heat radiation member and arranged in at least one space among a first space between the first semiconductor chip and at least one of the plurality of second semiconductor chips and a second space between at least two of the plurality of second semiconductor chips.