公开(公告)号：US20250135591A1

公开(公告)日：2025-05-01

申请号：US18927195

申请日：2024-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunchul KIM ,  Ohchel KWON ,  Daewoong CHOI ,  Hyunmo KANG ,  Jinhong PARK ,  Wooseok CHOE

IPC: B23Q3/08 ,  B23Q3/06

Abstract: A spin chuck includes an upper plate having an upper surface and a lower surface, the upper plate including a groove and a support pin on the upper surface of the upper plate, wherein the support pin is configured to support a substrate; an anti-slip plate below the upper plate, the anti-slip plate having an upper surface and a lower surface, wherein the anti-slip plate includes a first protrusion protruding in a vertical direction from the upper surface of the anti-slip plate toward the upper plate; and a lower plate below the anti-slip plate, the lower plate including a chucking pin configured to fix the substrate, wherein the lower plate has an upper surface and a lower surface, wherein the first protrusion of the anti-slip plate is coupled to the groove of the upper plate.