公开(公告)号：US10068768B2

公开(公告)日：2018-09-04

申请号：US15009921

申请日：2016-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-wook Oh ,  Jong-hyun Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/033 ,  H01L23/00 ,  H01L23/528 ,  H01L21/311 ,  H01L21/768

Abstract: Provided is a semiconductor device. The device includes a plurality of line patterns, which extend in a first direction and are arranged a first space apart from one another in a second direction perpendicular to the first direction. The line patterns include a line pattern set including two sub-line patterns that are arranged the first space apart from each other in the second direction and have a first width of a minimum feature size (1F) in the second direction, and a wide-width line pattern that is arranged the first space apart from one side of the line pattern set in the second direction and has a second width larger than the first width in the second direction.