公开(公告)号：US20240266144A1

公开(公告)日：2024-08-08

申请号：US18238874

申请日：2023-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAEWON JEONG ,  KYEONGTEA BANG ,  SEUNGBO SHIM ,  NAOHIKO OKUNISHI ,  KIHWAN JANG ,  KYUNG-SUN KIM

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J2237/327 ,  H01L21/3065

Abstract: A substrate processing apparatus including a process chamber providing a process space and a plasma generator on the process chamber. The plasma generator may include an inner antenna ring; an outer antenna ring outside of spaced apart from the inner antenna ring, and a floating ring between the inner antenna ring and the outer antenna ring. The floating ring may be electrically isolated from the inner antenna ring and the outer antenna ring.