公开(公告)号：US20180164171A1

公开(公告)日：2018-06-14

申请号：US15838583

申请日：2017-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNGHO HWANG ,  JANGHWAN KIM

IPC: G01L5/00 ,  H01L23/00

CPC classification number: G01L5/0076 ,  G01L5/0038 ,  H01L24/64 ,  H01L24/741 ,  H01L24/75 ,  H01L2021/603 ,  H01L2224/75824 ,  H01L2224/75841 ,  H01L2224/7592 ,  H01L2224/7598 ,  H01L2224/7692

Abstract: Provided is a method of correcting an estimated force of a bonding apparatus including measuring a first pressure of a first space in a chamber of a bonding apparatus and a second pressure of a second space in the chamber in a first state. In the first state a pressuring member is at rest within the chamber. The pressuring member is moveable within the chamber. The method includes obtaining a first estimated force. The first estimated force is an estimated force of the pressuring member in the first state, using the measured first and second pressures. The method includes obtaining a first error. The first error is a difference between a first real force and the first estimated force. The first real force is a real force of the pressuring member in the first state. The method includes correcting the first estimated force using the first error.